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Dynamic stress accelerated life test profile compilation method

An accelerated life test, dynamic stress technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of insignificant acceleration effect and difficult to guarantee consistency.

Active Publication Date: 2018-01-05
BEIJING INST OF STRUCTURE & ENVIRONMENT ENG +1
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

However, in the implementation process, if the stress level is increased too little, the acceleration effect will not be obvious; on the contrary, if the stress level is increased too much, it is difficult to guarantee the consistency of the failure mechanism of the product failure and the normal use state

Method used

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  • Dynamic stress accelerated life test profile compilation method
  • Dynamic stress accelerated life test profile compilation method
  • Dynamic stress accelerated life test profile compilation method

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Experimental program
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Embodiment Construction

[0056] Step 1: Statistically analyze the measured data of dynamic temperature stress to determine the temperature mean value T of the periodic function m , temperature amplitude T a , the cycle period w and the value of the coordination parameter b.

[0057] Analyze the measured dynamic temperature stress data, and according to the seasonal change law of temperature environmental stress, fit the dynamic temperature stress data into a chord function with a period of 1 year, and determine the temperature mean value T of the periodic function m , amplitude T a , the cycle period w and the value of the coordination parameter b. For example, the monthly average temperature stress data of a place for five consecutive years is shown in Table 1, and the fitted expression is:

[0058]

[0059] Table 1 Statistics of monthly average temperature stress in a place for 5 consecutive years (unit: K)

[0060]

[0061]

[0062] Step 2: According to the needs of the task, determine...

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Abstract

The invention relates to a dynamic stress accelerated life test profile compilation method. The method comprises the following steps that 1, on the basis of a damage equivalent principle, dynamic stress is converted into static stress within a certain time interval; 2, on the basis of the step 1, an equivalent relation of a dynamic stress accelerated factor and a static stress accelerated factor is obtained; 3, the dynamic temperature stress is adopted as the dynamic stress, and on the basis of an Arrhenius model, dynamic temperature accelerated stress accelerated factor computational formulais obtained; 4, the dynamic temperature accelerated stress profile is compiled, and three parameters including a dynamic temperature accelerated stress mean value Tm*, a dynamic temperature accelerated stress amplitude Ta* and a dynamic temperature accelerated stress cycle period w* are determined. According to the method, the dynamic stress accelerated life test profile can be designed accordingto the dynamic change environment actually adopted by products, the reality degree simulated by the environment conditions in the accelerated test is improved, and it is ensured that the product failure mechanism in the test is consistent to that under the actual service condition.

Description

technical field [0001] The invention relates to a dynamic stress accelerated life test profile preparation method, which belongs to the technical field of environment and reliability tests. Background technique [0002] As we all know, environmental and reliability testing is a necessary means to improve product quality and reliability, and its testing procedures are formulated according to technical specifications or technical conditions. The basis of the environmental test is the extreme use environment stipulated in the specification, and the basis of the reliability test profile is the combined design based on the normal use environment of product deployment and some extreme use environments. Product development usually follows the process of "design-test-improvement-redesign-retest-reimprovement-until product maturity", stimulate product failures through test methods, expose product weak points, and improve product reliability through improved design . This is an engi...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 吴建国冯国林杨万均李泽华李会娜封雪韦冰峰李海波张伟
Owner BEIJING INST OF STRUCTURE & ENVIRONMENT ENG
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