Element handler

Abstract

The present invention relates to an element handler, and more specifically to an element handler for loading and unloading an element, such as a semiconductor chip, in and from a burn-in board. The element handler according to the present invention comprises: a loading unit into which a loading a tray loaded with first elements is loaded; an X-Y table for moving a burn-in board, on which a first element is to be loaded, in X-Y directions to the empty spot from which second elements have been unloaded; a buffer unit in which the second elements unloaded from the X-Y table are temporarily loaded; and an unloading unit in which second elements of acceptable quality from among the second elements loaded in the buffer unit are loaded onto a tray.

Description

technical field [0001] The present invention relates to a component processor, and more specifically relates to a component processor that mounts components such as semiconductor chips on or out of a refining plate. Background technique [0002] Semiconductor elements (hereinafter, referred to as "elements") are subjected to various inspections such as electrical characteristics, reliability inspections on heat, and pressure after the packaging process is completed. [0003] In this kind of inspection of semiconductor components, there is a burn-in test (Burn-in Test). In the burn-in test, multiple components are inserted into the burn-in board, and the burn-in board is stored in the burn-in test device. After a predetermined time of heat or pressure, it is discriminated whether there is a defective component. [0004] Component handlers for burn-in tests generally refer to devices that classify (unload) the components from the plate that is carrying the components that hav...

AI Technical Summary

Problems solved by technology

[0008] However, the component handlers of the prior art have the following problem: the type of components to be sorted, i.e. the specification, is different. It is necessary for the user to manually exchange the components that match the specifications of the components in the DC test section, the socket presser on the chain plate, and the moving buffer, so there is a problem of cumbersome exchange operations.

[0014] However, in the adapter structure disclosed in Registered Utility Model No. 20-0463425, in order to mount components stably, a side space should be provided between the side of the component and the adapter, because there is a gap between the contact pin and the ball terminal in this side space. Arrangement state is destroyed problem

[0015] In addition, when the component is unloaded from the test socket, the component is stuck by the adapter and the operation of the device is terminated to reduce the efficiency of the inspection work.

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