Composition for forming coating film and method for forming coating film using same
一种组合物、覆膜的技术,应用在涂层等方向,能够解决气体阻隔性能不充分等问题,达到优异气体阻隔性能的效果
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[0028] Embodiments of the present invention will be described in detail below.
[0029] Composition for film formation
[0030] The film-forming composition of the present invention contains a silicon compound, a polysilazane, and an organic solvent as essential components, and may contain other additives as necessary. These respective components are described as follows.
[0031] silicon compound
[0032] In the present invention, a silicon compound having a specific structure is used as the silicon compound. When the composition layer formed from the film-forming composition of the present invention is exposed to light, the silicon compound reacts with polysilazane described later to form a cured film. This silicon compound is a compound represented by the following general formula (1).
[0033]
[0034] In the formula, R 1 Each is independently selected from hydrogen, halogen atom, hydrocarbon group, hydroxyl group, hydrocarbon hydroxyl group, acyl group, acyloxy...
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