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Shielding cover, circuit board assembly, and electronic equipment

A circuit board assembly and shielding cover technology, applied in the directions of printed circuit components, printed circuits, electrical components, etc., can solve the problems of large impedance, affecting the effect of shielding radiation interference signals, and long loops, so as to reduce impedance and improve shielding. Effects of the ability to radiate interfering signals

Active Publication Date: 2017-12-15
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the shielding cover is fixed on the surface of the circuit board by welding, and the reference main ground is set inside the circuit board. Therefore, the loop between the shielding cover and the reference main ground is long and the impedance is large, which affects the shielding of radiation interference. signal effect

Method used

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  • Shielding cover, circuit board assembly, and electronic equipment
  • Shielding cover, circuit board assembly, and electronic equipment
  • Shielding cover, circuit board assembly, and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] See Figure 1 to Figure 4 , this embodiment provides a circuit board assembly 100 , including a substrate 1 , an electronic module 2 and a shielding case 3 .

[0028] The electronic module 2 is disposed on the surface of the substrate 1 , and the shielding case 3 covers the electronic module 2 . The interior of the substrate 1 has a conductive layer 10 used as a reference ground, and at the same time, a positioning pad 11 is arranged on the surface of the substrate 1, and a jack 12 is opened in the area corresponding to the positioning pad 11, and the hole of the jack 12 There is a conductive element 13 on the wall. In this embodiment, the conductive element 13 is a copper sheet covering the wall of the insertion hole 12 . The conductive element 13 is in contact with the conductive layer 11 to realize electrical connection.

[0029] The shielding case 3 includes a shielding frame 31 and a shielding cover 32. The shielding cover 32 is set on the top of the shielding fra...

Embodiment 2

[0035] The difference between this embodiment and the first embodiment lies in that the positions of the concave-convex structures in this embodiment are changed. See Figure 6 , the edge of the bottom surface of the shielding cover 32 extends out of the side wall 322 protruding from the bottom surface, the inner side of the side wall 322 is provided with a second boss 323, and correspondingly, the outer side of the top of the shielding frame 31 is provided with a second groove 313, The second protrusion 323 of the shielding cover 32 is fitted into the second groove 313 of the shielding frame 31 .

[0036] It is easy to understand that the positions of the above-mentioned second boss 323 and the second groove 313 can be reversed. See Figure 7 , is another structure of the shield provided in this embodiment. The edge of the bottom surface of the shielding cover 32 extends out of the side wall 322 protruding from the bottom surface, and the inner surface of the side wall 322...

Embodiment 3

[0039] The difference between this embodiment and Embodiment 1 is that this embodiment adds the structure of Embodiment 2 on the basis of Embodiment 1. Please refer to Figure 8, the bottom surface of the shielding cover 32 is provided with a first boss 321 , the edge of the bottom surface of the shielding cover 32 extends from the side wall 322 protruding from the bottom surface, and the inner surface of the side wall 322 is provided with a second groove 324 . The top surface of the shielding frame 31 is provided with a first groove 312 , and at the same time, the outer surface of the top of the shielding frame 31 is provided with a second boss 314 . After the shielding cover 32 is combined with the shielding frame body 31, the first boss 321 of the shielding cover 32 is embedded in the first groove 312 of the shielding frame body 31, and the second boss 314 of the shielding frame body 31 is embedded in the first groove 314 of the shielding cover 32. Inside the two grooves 32...

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Abstract

The invention belongs to the technical field of electronic equipment, and provides a shielding cover, a circuit board assembly, and electronic equipment. The circuit board assembly comprises a substrate and a shielding case, wherein the surface of the substrate is provided with an electronic module, and the shielding case covers the electronic module. The interior of the substrate is provided with a conductive layer serving as a reference main floor. The substrate is provided with a jack, and the wall of the jack is provided with a conductive piece which is electrically connected with the conductive layer. The bottom of the shielding case is provided with a plug part, and the plug part is disposed in the jack, and is electrically connected with the conductive piece. Because the conductive piece is directly electrically connected with the conductive layer, serving as the reference main floor, in the substrate, a radiation interference signal on the shielding case can be directly imported into the reference main floor in the substrate through the conductive piece. Therefore, the circuit board assembly reduces the impedance through the reduction of a loop between the shielding cover and the reference main floor, and improves the capability of the shielding case for resisting the radiation interference signal.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment, and in particular relates to a shielding case, a circuit board assembly and electronic equipment. Background technique [0002] With the continuous development of electronic equipment intelligence, electronic equipment has more and more functions. At the same time, the number of electronic modules within electronic setups is increasing and they are densely distributed. Since the electronic modules will radiate electronic signals when they are working, if the electronic modules are close to each other, the signals between the electronic modules will inevitably interfere with each other, thereby affecting the performance of the electronic equipment. [0003] The shielding cover is mainly used in communication terminals, GPS and other fields to prevent interference between modules, or the sub-module radiation interferes with other signals. When the module works with radiation interfere...

Claims

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Application Information

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IPC IPC(8): H05K9/00H05K1/02H05K1/18
CPCH05K1/0218H05K1/184H05K9/0032H05K2201/10371
Inventor 范艳辉
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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