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Packaging structure and electron device

A packaging structure and technology for electronic devices, which are applied in the directions of antenna supports/installation devices, circuits, electrical components, etc., to achieve the effect of solving dimensional tolerances and facilitating connections

Active Publication Date: 2017-12-15
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The multi-antenna discrete antenna technology (8-port MU-MIMO) of the existing 4G cellular network is difficult to meet the explosive growth of high-speed data services

Method used

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  • Packaging structure and electron device
  • Packaging structure and electron device
  • Packaging structure and electron device

Examples

Experimental program
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Effect test

Embodiment Construction

[0062] The application is described below in conjunction with the accompanying drawings in the application.

[0063] The present application relates to a packaging structure, an electronic device using the packaging structure, and a packaging method. In one embodiment, the packaging structure is an integrated antenna packaging structure, and the electronic device may be a mobile phone, a tablet computer, or a router. Figure 1 to Figure 9 It is a schematic diagram of each step of the packaging method of the packaging structure 100 of the present invention. Figure 9 The packaging structure 100 is fabricated. Figure 10 and Figure 11 It is a schematic diagram of installing the package structure 100 on the motherboard of the electronic device.

[0064] see Figure 9 , the packaging structure 100 includes a first substrate 10 , a second substrate 20 , an electronic device 40 and a plurality of connecting pillars 30 . The electronic device 40 is installed on the surface of t...

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Abstract

The embodiment of the invention discloses a packaging structure comprising a first substrate, a second substrate, an electronic unit, and a plurality of connecting posts; the first surface of the first substrate is opposite to the first surface of the second substrate; the electron unit is arranged to the first surface of the first substrate; the first surface of the second substrate comprises a heat conductive zone; one side, close to the first substrate, of the electron unit makes contacts with the heat conductive zone; the plurality of connecting posts are arranged outside the electron unit; one end of the connecting post is connected with the first substrate, and the other end is connected with a connecting zone on the first surface of the second substrate; the connecting zone of the second substrate is isolated from the heat conductive zone. The invention also provides an electron device; packaging structure is easy to assembly, good in reliability, and high in heat radiation efficiency.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to an integrated antenna packaging structure and a packaging method for an integrated antenna device. Background technique [0002] With the continuous development of 5G wireless communication technology, the demand for high-speed data services and ubiquitous access is showing an explosive growth. The multi-antenna discrete antenna technology (8-port MU-MIMO) of the existing 4G cellular network is difficult to meet the explosive growth of high-speed data services. Using a very large-scale antenna array (such as hundreds of antennas or more) at the base station can bring many performance advantages. Such a base station using a large-scale antenna array is called a massive antenna array system (Massive MIMO). AIP (Antenna in Package) is an implementation of a large-scale antenna array system. [0003] How to solve the assembly problem, reliability problem and heat dissipation pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/58H01L23/66H01L21/56H01L23/488H01L23/367H01Q1/22
CPCH01L21/561H01L23/367H01L23/488H01L23/58H01L23/66H01Q1/2283H01L2224/16225H01L2224/48091H01L2224/73204H01L2224/73253H01L2224/73265H01L2224/97H01L2924/00014
Inventor 谢荣华陈开荣张宗民
Owner HUAWEI TECH CO LTD
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