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An electronic assembly process

An assembly process and electronic technology, applied in the direction of manufacturing tools, metal processing, auxiliary devices, etc., can solve the problems of affecting high-power devices, low bonding strength and thermal conductivity, and consumption, so as to improve work efficiency and shorten work time. Effect

Active Publication Date: 2019-09-17
TIME VARYING TRANSMISSION CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] The embodiment of the present invention provides an electronic assembly process, which solves the problem that the assembly process through the epoxy conductive adhesive will take a long time and the bonding strength and thermal conductivity of the outer epoxy conductive adhesive are lower than that of the metal solder. Low technical issues that directly affect the performance of high-power device products

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  • An electronic assembly process

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Embodiment Construction

[0028] The embodiment of the present invention provides an electronic assembly process, which solves the problem that the assembly process through the epoxy conductive adhesive will take a long time and the bonding strength and thermal conductivity of the outer epoxy conductive adhesive are lower than that of the metal solder. Low technical issues that directly affect the performance of high-power device products.

[0029] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without mak...

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Abstract

The invention discloses an electronic assembly process. The electronic assembly process comprises the steps of determining required welding procedures according to the current assembly condition of a to-be-welded electronic device; when one welding procedure is required, determining the welding temperature range of the welding procedure, selecting a welding flux of which the melting point is within the welding temperature range, and completing the welding procedure; and when at least two welding procedures are required, determining corresponding welding temperature ranges according to the welding procedures, selecting welding fluxes of which melting points are within the welding temperature ranges, and then completing each welding procedure in sequence by using the corresponding welding fluxes according to the sequence of the welding procedures. The technical problems that long time is taken by adopting the assembly process of epoxy conductive adhesive bonding and the product performance of a high-power device is directly influenced by low bonding strength and heat conductivity of outer epoxy conductive adhesives compared with brazing metal are solved.

Description

technical field [0001] The invention relates to the technical field of electronic assembly, in particular to an electronic assembly process. Background technique [0002] Electronic assembly technology is the technology of assembling basic electronic material components to form electronic products. [0003] At present, when assembling electronic products with high assembly density, small size and light weight, the commonly used assembly process is to use epoxy conductive components such as circuit chips and bases, chip devices and boxes, and chips and circuit chips. The way of glue bonding enables these elements to be physically supported and assembled together according to specific design requirements to form a modular product that can work independently. [0004] However, in this commonly used assembly process, since the conductive adhesive needs to be baked and cured at high temperature after bonding in each process, and the curing time is between 30 minutes and 210 minu...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K37/00B23K31/02B23K101/36
Inventor 龙秀森李跃星刘耿烨
Owner TIME VARYING TRANSMISSION CO LTD
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