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Integrated circuit test device and method for testing welding point by utilizing same

A testing device and integrated circuit technology, applied in electronic circuit testing, measuring device, measuring electricity and other directions, to avoid waste of resources, reduce cost and complexity of processing

Inactive Publication Date: 2017-12-08
SPREADTRUM COMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem solved by the present invention is how to reduce the cost of short-circuit test, reduce the time-consuming of short-circuit test, and improve the reliability of open-circuit test

Method used

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  • Integrated circuit test device and method for testing welding point by utilizing same
  • Integrated circuit test device and method for testing welding point by utilizing same
  • Integrated circuit test device and method for testing welding point by utilizing same

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Embodiment Construction

[0030] A chip or integrated circuit is connected to another chip or integrated circuit through solder balls as solder joints. Daisy-Chain (Daisy-Chain) product is an integrated circuit testing device, also known as "empty package" (Dummy Package) or fake chip (Fake Chip), mainly used for chip solder joints (that is, solder balls) ) verification tests for reliability, board-level interconnectivity, and process characteristics in the chip assembly process. Daisy-Chain products generally use a non-functional dummy die (Dummy Die) similar to a real chip and a package that is similar or identical to a real chip, but the substrate (substrate) is different from the real chip. On the substrate of Daisy-Chain products, there are some specific wiring patterns (patterns). When on the chip, a continuous daisy-chain (Daisy-Chain) that connects all packaged balls (balls) can be formed. By testing the continuity of the daisy-chain, the open circuit of the solder joints of the chip or integr...

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Abstract

The invention provides an integrated circuit test device and a method for testing a welding point by utilizing the same. The integrated circuit test device comprises a substrate and at least two daisy chain branches. The at least two daisy chain branches are mutually disjoint; each section of daisy chain sub-branch is suitable for connecting with two solder balls; each solder ball only exists in one daisy chain sub-branch; and the two solder balls are not directly adjacent in either the transverse direction or the vertical direction. The method comprises the following steps: setting daisy chain branches complementary to patterns of the at least two daisy chain branches of the integrated circuit test device in a one-to-one manner; serving a loop formed by the mutually-complementary daisy chain branches and solder balls connected with the mutually-complementary daisy chain branches as a daisy chain link; and by testing the connection state of the daisy chain link, obtaining open circuit and short circuit test results of each solder ball. According to the scheme above, cost of short-circuit test can be reduced, time in short-circuit test is reduced, and reliability of open circuit test is improved.

Description

technical field [0001] The invention relates to the field of chip testing, in particular to an integrated circuit testing device and a method for testing solder joints using the same. Background technique [0002] A chip or integrated circuit is connected to another chip or integrated circuit through solder balls as solder joints. Daisy-Chain (Daisy-Chain) product is an integrated circuit testing device, also known as "empty package" (Dummy Package) or fake chip (Fake Chip), mainly used for chip solder joints (that is, solder balls) ) verification tests for reliability, board-level interconnectivity, and process characteristics in the chip assembly process. Daisy-Chain products generally use a non-functional dummy die (Dummy Die) similar to a real chip and a package that is similar or identical to a real chip, but the substrate (substrate) is different from the real chip. On the substrate of Daisy-Chain products, there are some specific wiring patterns (patterns). When on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2853G01R31/2884
Inventor 郑公爵孟宪余
Owner SPREADTRUM COMM (SHANGHAI) CO LTD
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