Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultrasonic sensor

A sensor and ultrasonic technology, which is applied in the field of ultrasonic sensors, can solve the problems of performance degradation, structural influence, poor effect, etc., and achieve the effect of greatly reducing aftershock, simple structure, and improving echo sensitivity

Inactive Publication Date: 2017-12-08
SUZHOU YIDELONG ELECTRONICS COMPONENTS CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing ultrasonic sensor structures such as figure 1 As shown, it includes matching layer material 1, chip 2 and rubber part 3, wherein chip 2 is made separately, and then bonded to the chip with epoxy, the performance is reduced, and the damping effect of rubber part 3 is affected by the structure, and the effect is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasonic sensor
  • Ultrasonic sensor
  • Ultrasonic sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Such as figure 2 As shown, the ultrasonic sensor of the present invention includes a housing 1 and a piezoelectric wafer 2 placed in the housing, a base 3 is installed at one end of the housing, and a flexible glue 5 is fixed on the side of the piezoelectric wafer facing the base. The other side is fixed with a matching layer 4 . During specific implementation, the following steps are included.

[0021] The first step is to use epoxy with a density of 1.16 as the carrier, add glass beads and curing agent according to the ratio of epoxy: glass beads: curing agent = 1: (0.65-0.75): (0.4-0.5), and then press the ring Oxygen: epoxy silane coupling agent = 1: (0.010 ~ 0.013) Add epoxy silane coupling agent and vacuumize and stir until uniform to form a paste-like matching layer material.

[0022] In the second step, the shell and wafer are fixed with a special tooling fixture. Ensure that the wafer is placed in the middle of the housing, and the distance from the housing...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an ultrasonic sensor including a housing and a piezoelectric crystal plate disposed in the housing. A pedestal is mounted on one end of the housing. One side of the piezoelectric crystal plate facing towards the pedestal is provided with flexible adhesive fixedly while the other side is provided with a matching layer fixedly. The paste-shaped matching layer subjected to stirring is fixed on the piezoelectric crystal plate through adhesive dispensing or adhesive brush coating and the matching layer is in clearance-free bonding with the surface of the piezoelectric crystal plate. Then through heating, the material of the matching layer is cured fully, so that the matching layer and the piezoelectric crystal plate are integrated together. According to the invention, residual oscillation is reduced substantially and measurement dead zone is reduced. Through the method of bonding the material of the matching layer and the crystal plate integrally, the echo flexibility is improved. The ultrasonic sensor is simple in structure, low in cost increase and substantially improved in performance.

Description

technical field [0001] The invention relates to electronic components, in particular to an ultrasonic sensor with a new structure. Background technique [0002] At present, the application of the ultrasonic sensor in the test blind zone of 0.08 meters on the equipment determines that the equipment must provide enough space so that the ultrasonic sensor can distinguish the aftershock (clutter) and the primary echo (useful feedback), so that the equipment cannot Not designed to be relatively large and bulky. Existing ultrasonic sensor structures such as figure 1 As shown, it includes matching layer material 1, chip 2 and rubber part 3, wherein chip 2 is made separately, and then bonded to the chip with epoxy, the performance is reduced, and the damping effect of rubber part 3 is affected by the structure, and the effect is poor. Contents of the invention [0003] The object of the present invention is to provide an ultrasonic sensor with a new structure, so that the equipm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01D5/48
CPCG01D5/48
Inventor 萧建虎李勇跃
Owner SUZHOU YIDELONG ELECTRONICS COMPONENTS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com