Electroplating process capable of improving surface smoothness of pressure-equalized electrode probe of high-voltage direct-current converter valve
A technology of surface smoothness and equalizing electrodes, which is applied in the field of platinum electroplating, can solve the problems of increased nucleation difficulty, insufficient surface finish of equalizing electrode probes, high nucleation activation energy, etc., and achieves a simple and easy-to-control electroplating process Effect
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Embodiment 1
[0016] The electroplating solution is: 0.1 mol / L sodium tetrachloroplatinate, 0.3 mol / L disodium edetate. The temperature of the electroplating solution was adjusted to 25° C., and the pH value of the electroplating solution was adjusted to 7.0 by using 5% hydrochloric acid or 3% sodium hydroxide aqueous solution by mass ratio.
[0017] The voltage of the regulated power supply is controlled at 0.5V. The negative electrode is connected to the pressure equalizing electrode probe after degreasing as the working electrode, and the positive electrode is connected to a ring-shaped platinum sheet with a diameter of 10mm and a height of 100mm as the counter electrode. Placed in the middle of the ring-shaped platinum sheet, it is charged and sinks into the electroplating solution.
[0018] Adjust the potential of the stabilized power supply and control the plating current to 0.1mA / cm 2 , until the thickness of the coating is 0.2 μm and it becomes a mirror surface.
Embodiment 2
[0020] The electroplating solution is: 0.01mol / L sodium chloroplatinate, 0.5mol / L disodium edetate. Adjust the temperature of the electroplating solution to 5°C and the pH to 6.8.
[0021] The voltage of the stabilized power supply is controlled at 0.5V, the negative electrode is connected to the voltage equalizing electrode probe after degreasing, the positive electrode is connected to the ring-shaped platinum sheet, and the voltage equalizing electrode probe is placed in the middle of the ring-shaped platinum sheet, charged and sinks in the liquid.
[0022] Adjust the potential of the regulated power supply, and control the electroplating current to 0.03mA / cm 2 , until the thickness of the coating is 1 μm and it becomes a mirror surface.
Embodiment 3
[0024] The electroplating solution is: 1mol / L sodium chloroplatinate, 1mol / L tetrasodium ethylenediaminetetraacetic acid. Adjust the temperature of the electroplating solution to 15°C and the pH to 6.5.
[0025] The voltage of the stabilized power supply is controlled at 0.5V, the negative electrode is connected to the voltage equalizing electrode probe after degreasing, the positive electrode is connected to the ring-shaped platinum sheet, and the voltage equalizing electrode probe is placed in the middle of the ring-shaped platinum sheet, charged and sinks in the liquid.
[0026] Adjust the potential of the regulated power supply and control the plating current to 0.5mA / cm 2 , until the thickness of the coating is 5 μm and it becomes a mirror surface.
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