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Single defective product removing and supplementing-pasting mechanism and method for die cutting tape

A defect and material belt technology, applied in the field of die-cutting material belt single-piece rejection subsidy mechanism, can solve the problems of low degree of automation, production of defective products, and low efficiency.

Pending Publication Date: 2017-11-28
SHENZHEN HADESHENG PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Die-cutting machine is mainly used for some corresponding non-metallic materials, such as self-adhesive, OCA, EVA, double-sided tape, electronics, mobile phone rubber pad, etc. Combination, automatic waste discharge and other operations, die-cutting processing, that is, design and manufacture the knife mold according to the required product shape, specification and other proportions, and punch the raw materials or semi-finished products through the knife mold to achieve the desired processed product shape , but due to the error of die-cutting processing, defective products may be produced. It is necessary to use a waste discharge fixture to discharge the defective products on a single chip, and then subsidize the good products. In the prior art, there are two processes, the degree of automation is low, and the efficiency is low. low, room for improvement

Method used

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  • Single defective product removing and supplementing-pasting mechanism and method for die cutting tape
  • Single defective product removing and supplementing-pasting mechanism and method for die cutting tape
  • Single defective product removing and supplementing-pasting mechanism and method for die cutting tape

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Embodiment Construction

[0037] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0038] As an embodiment of the subsidy mechanism for single piece rejection of die-cutting strip defective products described in the present invention, such as Figure 1 to Figure 6 As shown, it includes a strip linear conveying device 1, a tear film waste discharge device 2 and a subsidy device 3 for good products. The strip linear conveyer 1 is used to convey the working material tape 10, and sends the defective product position to the tear film waste discharge device 2 locations and 3 subsidy devices for good products, the tear film waste discharge device 2 adopts the adhesive tape method to dis...

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Abstract

The invention relates to the technical field of waste discharge of a die cutting tape, in particular to a single defective product removing and supplementing-pasting mechanism and method for the die cutting tape. The mechanism comprises a tape linear conveying device, a film tearing and waste discharging device and a good product supplementing-pasting device; the tape linear conveying device is used for conveying the tape and sending a defective product position to the film tearing and waste discharging device and the good product supplementing-pasting device; the film tearing and waste discharging device is used for discharging waste by adopting an adhesive tape pasting method; and the good product supplementing-pasting device is used for supplementing and pasting a good product at the original defective product position. The single defective product removing and supplementing-pasting mechanism for the die cutting tape is used for automatically removing a defective product of the rolled die cutting tape and then automatically supplementing and pasting a good product on the tape, two tasks of removing the defective product and supplementing and pasting the good product can be completed at a time, the tape does not need to be repeatedly rolled so that the deformation influence on a tape product can be small, and therefore the time for removing the defective product and supplementing and pasting the good product can be greatly shortened, the productivity can be greatly improved, the manpower requirement can be lowered, a plurality of mechanisms can be managed by one person, and the mechanism is an excellent partner of product inspection equipment.

Description

technical field [0001] The invention relates to the technical field of die-cutting strip waste discharge, in particular to a subsidy mechanism and method for single-piece rejecting of defective die-cutting strips. Background technique [0002] Die-cutting machine is mainly used for some corresponding non-metallic materials, such as self-adhesive, OCA, EVA, double-sided tape, electronics, mobile phone rubber pad, etc. Combination, automatic waste discharge and other operations, die-cutting processing, that is, design and manufacture the knife mold according to the required product shape, specification and other proportions, and punch the raw materials or semi-finished products through the knife mold to achieve the desired processed product shape , but due to the error of die-cutting processing, defective products may be produced. It is necessary to use a waste discharge fixture to discharge the defective products on a single chip, and then subsidize the good products. In the ...

Claims

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Application Information

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IPC IPC(8): B26D7/18B26D7/00B26F1/38
CPCB26D7/00B26D7/1827B26F1/38
Inventor 陈林华李玉辉刘积平
Owner SHENZHEN HADESHENG PRECISION TECH
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