Double-side imprinted conductive film, manufacturing method thereof, circuit board and touch module

Abstract

The invention relates to a double-side imprinted conductive film, a manufacturing method thereof, a circuit board and a touch module. The manufacturing method of the double-side imprinted conductive film comprises the steps of S1, providing a transparent substrate and a mould group, wherein the transparent substrate comprises a first surface and a second surface which are arranged oppositely, and the mould group comprises an input end mould and an output end mould both having corresponding para-position targets; S2, imprinting an input end circuit on the first surface of the transparent substrate through the input end mould by utilizing a nanometer imprinting way, and imprinting an output end circuit on the second surface of the transparent substrate through the output end mould by utilizing the nanometer imprinting way; and S3, carrying out conductive coating and solidification at the input end circuit and the output end circuit. The manufacturing method of the double-side imprinted conductive film is simpler; and higher yield is obtained.

Description

technical field [0001] The invention relates to a method for manufacturing a double-sided embossed conductive film, a double-sided embossed conductive film, a circuit board and a touch module. Background technique [0002] As the most important way of human-computer interaction in modern society, touch screen has already been closely related to people's daily life. As an indispensable main component of touch screen, conductive film has been widely used in various display touch panels, photovoltaic devices, electromagnetic shielding, dimming film, electrodes and other fields, and its application space will continue to expand. [0003] Common structures of touch screens include GFF, GF, GG, etc. Most of the conductive films used are flexible patterned transparent conductive films. The structure of a conventional touch screen is composed of a cover plate and two layers of conductive film, the transmittance of which is relatively lower, and the production cost remains high. E...

AI Technical Summary

Problems solved by technology

Even if some production methods are produced according to the single-layer multi-point design scheme, due to the relatively low production yield, especially the large-size transparent conductive surface, its alignment severely limits the use of single-layer multi-point

At the same time, the production of single-layer multi-point also needs to use screen printing to make the lead wires, which is relatively complicated in process

These problems undoubtedly limit the application of transparent conductive films.

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