Heat radiation structure and manufacturing method thereof

A technology of heat dissipation structure and manufacturing method, which is applied in the direction of modification by conduction and heat transfer, cooling/ventilation/heating transformation, semiconductor/solid-state device manufacturing, etc. problems, to achieve the effect of cost saving and simple production process

Active Publication Date: 2017-11-17
AVARY HLDG (SHENZHEN) CO LTD +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the graphite heat sink is wrinkled during the bonding process, the molecular structure of the graphite will be destroyed, the thermal conductivity will be greatly reduced, and the heat dissipation effect will not be ideal.

Method used

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  • Heat radiation structure and manufacturing method thereof
  • Heat radiation structure and manufacturing method thereof
  • Heat radiation structure and manufacturing method thereof

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Embodiment Construction

[0027] The heat dissipation structure provided by the present invention and its manufacturing method will be further described in detail below with reference to the accompanying drawings and embodiments.

[0028] see Figure 1-7 , the first embodiment of the present invention provides a method for manufacturing a heat dissipation structure, the steps of which include:

[0029] In the first step, a single-sided flexible copper-clad substrate 10 is provided and the single-sided flexible copper-clad substrate 10 is embossed to form at least one receiving groove 110 .

[0030] Please refer to figure 1 , the single-sided flexible copper-clad substrate 10 provided includes a base material layer 12 and a copper-clad layer 14 attached to the base material layer 12 , and the length of the base material layer 12 is equal to the length of the copper-clad layer 14 . The base material layer 12 has a thickness of 12-50 μm, and the copper clad layer 14 has a thickness of 12-140 μm. The ma...

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Abstract

The present invention provides a manufacturing method of a heat radiation structure. The method comprises the following steps: providing a one-side flexible copper-clad substrate which comprises a copper-clad layer, wherein the one-side flexible copper-clad substrate is subjected to pressing and molding to form at least one holding tank, the copper-clad layer is configured to form the inner surface of the at least one holding tank, a support portion is formed around the at least one holding tank, and the support portion encircles the at least one holding tank; forming a bonding portion on the support portion; filling phase-change materials in the holding tank; and providing a covering portion, pressing the covering portion to the one-side flexible copper-clad substrate, wherein the covering portion is fixed with the copper-clad layer through the bonding portion to seal the holding tank, the covering portion and the at least one holding tank form a sealed cavity, and the phase-change materials are held in the sealed cavity. The present invention further relates to a heat radiation structure.

Description

technical field [0001] The invention relates to circuit board heat dissipation technology, in particular to a heat dissipation structure and a manufacturing method thereof. Background technique [0002] With the development of processing chips in the direction of high frequency and high integration, and the development of displays in the direction of high pixel ratio, the problem of heat dissipation in electronic equipment equipped with high frequency processors and high pixel ratio displays has become increasingly prominent. At present, the industry mostly uses materials with high thermal conductivity to diffuse heat into the air through thermal radiation. In the field of small electronic products such as mobile phones, the most commonly used thermal radiation diffusion material in the industry is graphite heat sink, and the graphite heat sink is attached to the heat-generating areas such as shielding covers and metal plates of electronic products. However, if the graphite...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H01L21/4882H01L23/3735H01L23/3736H01L23/3737H01L23/4275B21D39/00H05K7/2039
Inventor 侯宁雷聪李彪何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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