Heat dissipation structure and manufacturing method thereof

A technology of heat dissipation structure and manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, modification through conduction heat transfer, semiconductor/solid-state device manufacturing, etc., which can solve the damage of graphite molecular structure, lower thermal conductivity, and unsatisfactory heat dissipation effect, etc. problems, to achieve the effect of simple production process and cost saving

Active Publication Date: 2019-07-23
AVARY HLDG (SHENZHEN) CO LTD +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the graphite heat sink is wrinkled during the bonding process, the molecular structure of the graphite will be destroyed, the thermal conductivity will be greatly reduced, and the heat dissipation effect will not be ideal.

Method used

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  • Heat dissipation structure and manufacturing method thereof
  • Heat dissipation structure and manufacturing method thereof
  • Heat dissipation structure and manufacturing method thereof

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Embodiment Construction

[0027] The heat dissipation structure provided by the present invention and its manufacturing method will be further described in detail below with reference to the accompanying drawings and embodiments.

[0028] see Figure 1-7 , the first embodiment of the present invention provides a method for manufacturing a heat dissipation structure, the steps of which include:

[0029] In the first step, a single-sided flexible copper-clad substrate 10 is provided and the single-sided flexible copper-clad substrate 10 is embossed to form at least one receiving groove 110 .

[0030] Please refer to figure 1 , the single-sided flexible copper-clad substrate 10 provided includes a base material layer 12 and a copper-clad layer 14 attached to the base material layer 12 , and the length of the base material layer 12 is equal to the length of the copper-clad layer 14 . The base material layer 12 has a thickness of 12-50 µm, and the copper clad layer 14 has a thickness of 12-140 µm. The ma...

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Abstract

A method for manufacturing a heat dissipation structure, the steps of which are as follows: providing a single-sided flexible copper-clad substrate, the single-sided flexible copper-clad substrate includes a copper-clad layer, forming at least one receiving groove by embossing the flexible copper-clad substrate, And the copper clad layer is used to form the inner surface of the at least one receiving tank, a supporting part is formed around the at least one receiving tank, and the supporting part surrounds the at least one receiving tank; a joint part is formed on the supporting part; fill the phase change material in the groove; provide a covering part, press the covering part to the single-sided flexible copper-clad substrate, the covering part is fixed with the copper-clad layer through the joint part to seal the receiving groove, and the covering part and the copper-clad layer are fixed. The at least one containing groove forms a sealed cavity, and the phase change material is contained in the sealed cavity. The invention also relates to a heat dissipation structure.

Description

technical field [0001] The invention relates to circuit board heat dissipation technology, in particular to a heat dissipation structure and a manufacturing method thereof. Background technique [0002] With the development of processing chips in the direction of high frequency and high integration, and the development of displays in the direction of high pixel ratio, the problem of heat dissipation in electronic equipment equipped with high frequency processors and high pixel ratio displays has become increasingly prominent. At present, the industry mostly uses materials with high thermal conductivity to diffuse heat into the air through thermal radiation. In the field of small electronic products such as mobile phones, the most commonly used thermal radiation diffusion material in the industry is graphite heat sink, and the graphite heat sink is attached to the heat-generating areas such as shielding covers and metal plates of electronic products. However, if the graphite...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H01L21/4882H01L23/3735H01L23/3736H01L23/3737H01L23/4275B21D39/00H05K7/2039
Inventor 侯宁雷聪李彪何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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