Selective wave crest welding spray nozzle structure and spray nozzle disc composed of same

Abstract

The invention discloses a selective wave crest welding spray nozzle structure. The spray nozzle structure is divided into a first part and a second part, wherein the first part is vertically arranged on a tin cylinder, the second part is arranged on the first part, and the second part and the first part have the inclination angle A in the vertical direction. The invention further discloses a spray nozzle disc composed of the selective wave crest welding spray nozzle structure. The tension of surplus tin liquid between a tin wave of a spray nozzle and a lead foot can be increased, interference of various factors to the detinning process is reduced, and the tin connection risk is reduced; and the overflow range of the tin wave of the spray nozzle on a PCB is reduced to make larger space for a surface mounted device, washed piece defects are reduced, and the size of the whole PCB is reduced.

Description

technical field [0001] The invention relates to the field of automobiles, in particular to a selective wave soldering nozzle structure. The invention also relates to a nozzle plate consisting of said selective wave soldering nozzle structure. Background technique [0002] The maximum stable and undisturbed peak height of the full-size wave nozzle of traditional wave soldering is less than 8mm, that is, when the soldering surface is designed with components with a height of 8mm, and the thickness of the bottom of the component to be covered by the fixture is usually 2mm, that is, when the actual component When the height is greater than 6mm, traditional wave soldering cannot be used. For smaller and higher-density electronic circuit board designs, more flexible soldering methods are required. On this basis, selective wave soldering came into being. [0003] The basic idea of ​​selective wave soldering is to reduce the size of the wave nozzle of traditional wave soldering to ...

AI Technical Summary

Problems solved by technology

[0009] 1. Reference figure 1 As shown, the existing design of the multi-nozzle, when the solder joints are combined with the tin liquid during work, the excess tin liquid is pulled off by the tin liquid in the tin tank from the vertical direction due to tension, and the tin liquid is drawn off during the de-tinning process. The interference of various factors such as the length of the foot, the height of the liquid level, the flatness of the liquid level, the relative flatness of the tray and the nozzle, etc., is prone to poor solder connection

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