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Substrate wet process technological method and substrate wet process technological apparatus

A process method and technology of wet process, applied in the field of substrate wet process process method and wet process process device, can solve the problems such as the reduction of etching yield rate, achieve resource saving, control the etching rate and the amount of chemical solution carried out, and improve etching Effect of process and cleaning process methods

Active Publication Date: 2017-09-15
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the embodiment of the present invention provides a substrate wet process process method and a wet process process device, which are used to solve the technical problem of reduced etching yield in the existing wet etching process

Method used

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  • Substrate wet process technological method and substrate wet process technological apparatus
  • Substrate wet process technological method and substrate wet process technological apparatus
  • Substrate wet process technological method and substrate wet process technological apparatus

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Embodiment Construction

[0044] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] The step numbers in the drawings are only used as reference numbers for the steps and do not indicate the order of execution.

[0046] The substrate wet process process method according to the embodiment of the present invention includes methods such as cleaning before etching, etching and cleaning after etching.

[0047] Cleaning before etching includes one or more of the following methods:

[0048] Ultraviolet irradiation, u...

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Abstract

The invention discloses a substrate wet process technological method, and aims to solve the technical problem of potential damage in the substrate processing process in the existing wet etching process. The technological method comprises the steps of setting a bearing platform and fixing a substrate through the bearing platform; moving the bearing platform along a circumferential track to convey the substrate; setting processing equipment along the outer side of the circumferential track; and in the substrate conveying process, adjusting the orientation and / or height of the substrate by the bearing platform to be matched with the processing equipment. The moving technological beat of the bearing platform along the circumferential track is controlled by an annular conveyor belt, so that consumed resource, manpower, time and other maintenance cost in replacing a huge number of rolling wheels periodically can be saved; the etching process and cleaning technological method are further improved; the jetting direction of the medicinal liquid and net water flow is changed; etching rate and medicinal liquid take-out amount are controlled effectively; and the cost is lowered while the etching quality can be effectively ensured. The invention also provides a substrate wet process technological apparatus.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a substrate wet process technology method and a wet process device. Background technique [0002] The device utilized by the existing substrate wet process method usually adopts rollers (ie, rollers) arranged in sequence on the conveyor belt to carry the glass substrate, so as to complete the transportation of the substrate between the processes. A large number of rollers are time-consuming and labor-intensive to maintain, and any single point of failure will cause damage to the substrate, resulting in scratches or fragments, resulting in lower etching yields. But as an infrastructure, conveyor belts are expensive, and large-scale, regular roller replacement consumes a lot of maintenance costs. SUMMARY OF THE INVENTION [0003] In view of this, embodiments of the present invention provide a substrate wet process technology method and a wet process process device, whic...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/67H01L21/677
CPCH01L21/02057H01L21/67011H01L21/67023H01L21/67034H01L21/67051H01L21/677H01L2221/67H01L2221/683
Inventor 孙静
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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