Pressing Die for Multi-stage Adjustable Tantalum Electrolytic Capacitor Using Vibration Assist

A technology for tantalum electrolytic capacitors and pressing molds, which is applied in the manufacture of capacitors, capacitors, circuits, etc., can solve the problems of complex structure, low efficiency, and low energy utilization rate, and achieve complex structure, wide application prospects, and volume reduction. Effect

Active Publication Date: 2019-02-15
CHANGCHUN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of complex structure, uneven distribution of pressing density and complicated assembly steps in the above-mentioned existing powder pressing technology, as well as the low efficiency, complex structure and low energy utilization rate in the powder ultrasonic forming pressing technology, the present invention discloses A multi-stage adjustable tantalum electrolytic capacitor pressing die with vibration assistance

Method used

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  • Pressing Die for Multi-stage Adjustable Tantalum Electrolytic Capacitor Using Vibration Assist
  • Pressing Die for Multi-stage Adjustable Tantalum Electrolytic Capacitor Using Vibration Assist
  • Pressing Die for Multi-stage Adjustable Tantalum Electrolytic Capacitor Using Vibration Assist

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specific Embodiment approach 1

[0055] Specific implementation mode one: combine Figure 1~Figure 16 This embodiment will be described.

[0056] This embodiment provides a specific implementation of a vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die. The vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die can be a low-friction stacked tantalum electrolytic capacitor pressing die; the low-friction stacking tantalum electrolytic capacitor pressing die includes a pressing die 1, a height adjustment ring 2, and a cage 3. Female mold component 4, fixed sleeve 5, limit component 6, anti-friction excitation component 7 and pressure pole block 8; said die 1 is connected with the height adjustment ring 2, and the height adjustment ring 2 is opposite to the pressure die 1 Play a position-limiting role; the height-adjusting ring 2 and the female mold assembly 4 are connected through the space-limiting assembly 6; Function; the female mold assemb...

specific Embodiment approach 2

[0066] Specific implementation mode two: combination Figure 17~Figure 30 This embodiment will be described.

[0067] This embodiment provides another specific embodiment of a vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die. The vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die can be a flexible hinged tantalum electrolytic capacitor pressing die; the flexible hinged tantalum electrolytic capacitor pressing die includes a punch 101, a height adjustment ring 102, and a tightening ring 103 , mold body assembly 104, fixed installation sleeve 105, positioning device 106, vibrating assembly 107 and electric limit block 108; Described punch 101 is connected with height adjustment ring 102, and height adjustment ring 102 is limited to punch 101 The position effect; the height adjustment ring 102 is connected with the phantom assembly 104; the fastening ring 103 is connected with the phantom assembly 104 by s...

specific Embodiment approach 3

[0077] Specific implementation mode three: combination Figure 31~Figure 41 This embodiment will be described.

[0078] This embodiment provides another specific embodiment of a vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die. The vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die can be an oblique chip type tantalum electrolytic capacitor pressing die; body 203, electrode fixing block 204, and piezoelectric sheet 205; the stamping die body 201 is connected to the height adjustment device 202 through surface contact; the height adjustment device 202 is connected to the mold body 203 through surface contact; the electrode fixing block 204 is connected with the mold body 203 by means of interference fit; the piezoelectric sheet 205 is connected with the mold body 203 by adhesive.

[0079] The stamping die body 201 is provided with a round table 201-1, a base 201-2, a molding surface 201-3 and an outer c...

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Abstract

The invention discloses a vibration-assisted multi-stage regulation type tantalum electrolytic condenser pressing mold, and solves the problems such as structure complexity, uneven pressing density distribution and complicated assembling steps in powder pressing technology and low efficiency, structure complexity and low energy utilization rate in powder ultrasonic forming and pressing technology. The vibration-assisted multi-stage regulation type tantalum electrolytic condenser pressing mold disclosed by the invention can be in low-friction stacking type, flexible hinge type and inclined patch type. The complexity degree in mold assembling process and tantalum powder pressing process is greatly reduced through a multi-stage regulation manner; tantalum powder inside a mold generates high-frequency vibration through an inverse piezoelectric effect of a piezoelectric element, and the friction between tantalum powder particles and the friction between the tantalum powder and the mold are reduced based on an ultrasonic friction reduction principle, so that the purpose of uniform tantalum powder density distribution is reached. The vibration-assisted multi-stage regulation type tantalum electrolytic condenser pressing mold has the technical advantages of simple structure, good pressing effect, low cost and the like, and has wide application prospects in the field of tantalum electrolytic capacitor machining.

Description

technical field [0001] The invention relates to a vibration-assisted multi-stage adjustable tantalum electrolytic capacitor pressing die, which belongs to the technical field of electronic component production and manufacturing. Background technique [0002] With the rapid progress of electronic technology, the upgrading speed of digital electronic products is getting faster and faster, which drives the rapid development of the capacitor industry, and at the same time puts forward higher technical requirements for the production quality and performance of capacitors. In particular, tantalum capacitors have been widely concerned and applied in the technical field of electronic components because of their technical advantages such as stable electrical performance, high reliability, large storage capacity, and good stability, especially in the technical fields of aerospace and military supporting equipment. , the technical requirements for tantalum capacitors are gradually deve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G13/00B22F3/03B22F3/093
CPCB22F3/03B22F3/093H01G13/00
Inventor 程廷海李奇涵秦峰陈鹏飞张晓松张大义张邦成卢晓晖李杰王志华李慧
Owner CHANGCHUN UNIV OF TECH
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