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An electromagnetic field near-field pcb probe

An electromagnetic field and near-field technology, applied in the field of measurement probes, can solve the problems of environmental temperature influence, measurement accuracy and sensitivity instability, etc., achieve stable temperature interference resistance, good measurement repeatability and stability, and overcome the susceptibility to the environment The effect of temperature influence

Inactive Publication Date: 2019-05-14
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an electromagnetic field near-field PCB probe, which is an electromagnetic field near-field PCB probe with temperature compensation. The structure adjusts the temperature-capacitance parameters, which overcomes the defects that the existing electromagnetic field near-field PCB probes are easily affected by the ambient temperature, and the measurement accuracy and sensitivity are unstable.

Method used

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  • An electromagnetic field near-field pcb probe
  • An electromagnetic field near-field pcb probe
  • An electromagnetic field near-field pcb probe

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Embodiment

[0032]An electromagnetic field near-field PCB probe of this embodiment is an electromagnetic field near-field PCB probe with temperature compensation, and its composition is as described above figure 1 The illustrated embodiment includes embedded stripline 1, four-layer PCB printed circuit board 2, negative temperature coefficient thermistor 3, voltage divider resistor 4, varactor diode 5, 2V DC power supply 6 and SMA terminal 7; the above The connection method of the components is: the 2V DC voltage provided by the 2V DC power supply 6 is added to the series circuit composed of the negative temperature coefficient thermistor 3 and the voltage dividing resistor 4, and the connection point of the negative temperature coefficient thermistor 3 and the voltage dividing resistor 4 It is a voltage dividing point, which is connected to the negative pole of the varactor diode 5, and the anode of the varactor diode 5 is connected to the copper ground on the surface of the four-layer PCB...

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Abstract

The invention provides an electromagnetic-field near-field PCB probe, which relates to the measuring probe to measure electromagnetic variables and serves as an electromagnetic-field near-field PCB probe with temperature compensation. The probe is structured by an embedded type strip line, a four-layer PCB, a negative temperature coefficient thermal resistor, a voltage division resistor, a variable capacitance diode, a 2V direct current power supply and an SMA terminal. Through the use of the thermal resistor, the variable capacitance diode and the voltage division resistor to adjust the temperature-capacitance parameters for the strip line structure of the probe, it is possible to overcome the defects of a currently available electromagnetic-field near-field PCB probe that the probe is prone to be influenced by environmental temperature, and that the measuring precision and sensitivity are not stable enough.

Description

technical field [0001] The technical solution of the invention relates to a measuring probe for measuring electromagnetic variables, in particular to an electromagnetic field near-field PCB probe. Background technique [0002] New technologies and new equipment for near-field detection of electromagnetic fields emerge in an endless stream. In the actual measurement process, the test equipment for electromagnetic field near-field detection is easily disturbed by the surrounding environment. In addition to the inherent characteristics of the equipment itself, the ambient temperature has a great influence on the sensing equipment and materials, especially the PCB circuit substrate and electromagnetic field. Near-field PCB probes. In the range of ambient temperature from 0 to 80 degrees Celsius, the variation range of the dielectric constant of the PCB material can reach more than 10%. In the actual test environment, the temperature distribution on the surface of circuit board...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R29/08
CPCG01R29/0878
Inventor 李尔平宋涛李伶研
Owner HEBEI UNIV OF TECH
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