Semiconductor refrigerating assembly and ice cream machine

Abstract

The invention provides a semiconductor refrigerating assembly and an ice cream machine. The semiconductor refrigerating assembly comprises a semiconductor galvanic coupling pair, a cold end base plate connected with the cold end of the semiconductor galvanic coupling pair, a hot end base plate connected with the hot end of the semiconductor galvanic coupling pair, and a liquid cooling device. The hot end base plate comprises a metal base plate, and a heat conduction insulation layer connected between the metal base plate and the semiconductor galvanic coupling pair. The liquid cooling device comprises a liquid cooling base body connected with the metal base plate, a liquid containing groove is formed in the installation face, connected with the metal base plate, of the liquid cooling base body, and flowing cooling liquid is arranged between the liquid containing groove and the metal base plate. A metal plate is arranged on the hot end face, connected with the cooling liquid base body, of the metal base plate, at least two metal heat conduction parts are arranged on the metal plate, and the metal heat conduction parts stretch in the liquid containing groove. By means of the semiconductor refrigerating assembly and the ice cream machine, the heat dissipation rate of the semiconductor galvanic coupling pair on the hot end can be improved, and large-power refrigerating can be achieved.

Description

technical field [0001] The invention relates to semiconductor refrigeration technology, in particular to a semiconductor refrigeration assembly and an ice cream machine. Background technique [0002] Thermoelectric Cooler (TEC, Thermoelectric Cooler) is a cooling device made using the Peltier effect. Its main structure is a pair of semiconductor galvanic couples (also called P-N galvanic couples). After a certain voltage is applied to the pair, there will be a certain temperature difference between the cold end and the hot end of the semiconductor couple. When the heat at the hot end is dissipated, the cold end will generate a certain amount of cold to achieve refrigeration. Due to the small size and high cooling efficiency of refrigeration devices made of semiconductor refrigeration chips, they have begun to be popularized and applied in small household appliances such as ice cream machines. [0003] figure 1 It is a structural schematic diagram of an existing semiconduc...

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Problems solved by technology

[0004] In the above refrigeration assembly, since the hot end substrate 13 and the heat dissipation substrate 16 are fixed by welding, the heat of the hot end of the semiconductor couple pair 12 is conducted through the hot end substrate 13, the solder and the heat dissipation substrate 16 successively, and the hot end substrate 13 is removed. In addition to the thermal resistance of the heat dissipation substrate 16 itself, the solder between the two also has a large thermal resistance, which seriously affects the heat conduction rate.

Moreover, the rate of heat exchange between the fins and the surrounding air is also very low, which also greatly affects the dissipation of heat from the 12 hot ends of the semiconductor couple.

Therefore, due to the large thermal resistance of the solder and the slow speed of heat exchange between the fins and the air, the existing semiconductor refrigeration components are only suitable for low-power refrigeration, but cannot achieve high-power refrigeration.

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