Manufacturing method of electronic circuit board and electronic circuit board obtained by the manufacturing method

Abstract

The present invention provides a method of manufacturing an electronic circuit substrate, which is a method of manufacturing an electronic circuit substrate including a substrate and an electronic circuit of a predetermined pattern, the electronic circuit is formed of a nano-ink composition containing metal particles and fixed to the substrate On the material, the manufacturing method includes the following steps: a holding step, in which the nano-ink composition containing metal particles is held on a printing plate on which an ink holding part with a predetermined pattern is formed on the surface; a transfer step, in which In this step, the surface of the above-mentioned substrate is brought into close contact with the above-mentioned printing plate, and the nano-ink composition held in the above-mentioned ink holding part is transferred to the above-mentioned substrate (work W); and the electronic circuit forming step, in this step In the method, after the transfer step, the transferred nano-ink composition is dried and fixed in an environment of 40° C. or lower in the air to form an electronic circuit with a predetermined pattern. According to this method, a layer composed of a uniform nano-ink composition can be rapidly and efficiently formed at normal temperature and normal pressure.

Description

technical field [0001] The present invention relates to a method for manufacturing an electronic circuit substrate in which an electronic circuit is formed on a base material at room temperature using conductive ink, and an electronic circuit substrate obtained by the method. Background technique [0002] Printed electronics technology that uses printing technology to form electronic components, electronic circuits, etc. is to apply (print or transfer) ink-shaped functional materials (metals, semiconductor materials, etc.) patterned to carry out. This method does not require large-scale and expensive manufacturing equipment such as a vacuum device, and thus has recently attracted attention as a technique capable of forming large-area elements and element substrates at low cost. However, in conventional printed electronics technology, a heating process at 100°C to 200°C or higher is required in the firing process of the functional material. Therefore, it is impossible to use...

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Problems solved by technology

However, in conventional printed electronics technology, a heating process at 100°C to 200°C or higher is required in the firing process of the functional material. Therefore, it is impossible to use a base material that expands and contracts due to heating, such as a resin film, as a substrate. such shortcomings

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