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Method for manufacturing electronic circuit substrate, and electronic circuit substrate obtained thereby

A technology of circuit substrates and manufacturing methods, applied in the fields of printed circuit manufacturing, flexible printed circuit boards, printed circuits, etc., to achieve the effect of excellent storage stability

Active Publication Date: 2017-08-18
KOMURA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in conventional printed electronics technology, a heating process at 100°C to 200°C or higher is required in the firing process of the functional material. Therefore, it is impossible to use a base material that expands and contracts due to heating, such as a resin film, as a substrate. such shortcomings

Method used

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  • Method for manufacturing electronic circuit substrate, and electronic circuit substrate obtained thereby
  • Method for manufacturing electronic circuit substrate, and electronic circuit substrate obtained thereby
  • Method for manufacturing electronic circuit substrate, and electronic circuit substrate obtained thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] Under the above-mentioned conditions, utilize the flexographic printing machine on the same area of ​​the printed surface (coated surface) of the base material (photo paper a), the nano-ink composition is coated continuously 1 time or 3 times, respectively, Lamination was carried out 6 times, and it was left to air-dry at room temperature (23° C.) for 60 minutes in the air to obtain the electronic circuit board of “Example 1” in which the electronic circuit was transferred and formed on the base material.

Embodiment 2

[0104] Except using the PET film c (coated ink receiving layer) as the base material, the nano-ink composition was continuously applied once on the same area of ​​the base material surface using a flexographic printing machine as in the above-mentioned Example 1. Or 3 times, 6 times, and left at room temperature (23° C.) for 60 minutes in the atmosphere to obtain the electronic circuit board of “Example 2”.

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Abstract

A method for manufacturing an electronic circuit substrate wherein a prescribed pattern of an electronic circuit comprising a nanoink composition containing metal particles is affixed to a base material, said method having: a step wherein a nanoink composition containing metal particles is held on a printing plate on the surface of which a prescribed pattern of an ink-holding section has been formed; a step wherein the surface of the base material is adhered to the printing plate, and the nanoink composition held in the ink-holding section is transferred to the base material (the workpiece (W)); and a step wherein, after the transfer, the transferred nanoink composition is dried and solidified in the air, in an environment of 40DEG C or less, thereby forming an electronic circuit having a prescribed pattern. By means of this method it is possible to apply a uniform nanoink composition layer quickly and efficiently at room temperature and atmospheric pressure.

Description

technical field [0001] The present invention relates to a method for manufacturing an electronic circuit substrate in which an electronic circuit is formed on a base material at room temperature using conductive ink, and an electronic circuit substrate obtained by the method. Background technique [0002] Printed electronics technology that uses printing technology to form electronic components, electronic circuits, etc. is to apply (print or transfer) ink-shaped functional materials (metals, semiconductor materials, etc.) patterned to carry out. This method does not require large-scale and expensive manufacturing equipment such as a vacuum device, and thus has recently attracted attention as a technique capable of forming large-area elements and element substrates at low cost. However, in conventional printed electronics technology, a heating process at 100°C to 200°C or higher is required in the firing process of the functional material. Therefore, it is impossible to use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12B41M1/04B41M1/30B41F3/20B41F17/14
CPCB41M1/04B41M1/30B41F3/20B41F17/14C09D11/52H05K3/1275H05K3/1283H05K2203/1131H05K1/097H05K1/092H05K2201/05H05K3/12H05K2201/0257
Inventor 金原正幸浦野雅明
Owner KOMURA TECH
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