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The method of making the jack on the pcb and the pcb

A production method and technology of the upper sub-section, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as poor crimper jacks, and achieve the effect of ensuring the quality of the opening and improving the alignment accuracy.

Active Publication Date: 2019-05-07
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing manufacturing process, it is easy to have the problem of matching hole position accuracy between the wiring through holes of the upper sub-board and the wiring through holes opened after the motherboard is manufactured, resulting in poor crimping connector jacks

Method used

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  • The method of making the jack on the pcb and the pcb
  • The method of making the jack on the pcb and the pcb
  • The method of making the jack on the pcb and the pcb

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Embodiment Construction

[0032] In order to explain in detail the technical solutions adopted by the present invention to achieve the intended technical purpose, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described implementation Examples are only part of the embodiments of the present invention, rather than all embodiments, and, on the premise of not paying creative work, the technical means or technical features in the embodiments of the present invention can be replaced, the following will refer to the accompanying drawings and combine Examples illustrate the present invention in detail.

[0033] see figure 1 , a method for manufacturing a socket of a PCB crimping device, which is realized by a brand-new process route, and the specific manufacturing steps are as follows:

[0034] 1) Provide several core boards, process sev...

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PUM

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Abstract

The invention provides a PCB jack making method comprising the following steps: (1) a plurality of core boards are provided, and X-ray alignment targets are arranged near the corners of each core board; (2) two daughter boards are prepared, wherein each daughter board is prepared by laminating a plurality of core boards; (3) an X-ray target drilling machine is provided, X-ray scanning is carried out, the X-ray alignment targets at the corresponding corners of each core board are captured, and daughter board alignment holes are drilled; (4) a CCD drilling machine is provided, and the CCD drilling machine captures the daughter board alignment holes for alignment, drills daughter board crimping through holes, and additionally drills motherboard alignment holes and pin holes at the corners of the daughter boards; (5) the two daughter boards are laminated into a motherboard through PIN-LAM and pin lamination; and (6) the CCD drilling machine captures the motherboard alignment holes for alignment and drills motherboard crimping through holes in the motherboard, and the motherboard crimping through holes and the daughter board crimping through holes on the surface form a crimper jack. Through the method of jack making, the precision of alignment between the motherboard crimping through holes and the daughter board crimping through holes is improved, and the quality of the crimper jack is ensured.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board (PCB), in particular to a method for manufacturing a socket on the PCB and the PCB. Background technique [0002] With the development of high-speed digitalization of integrated circuits, as well as the upgrading and replacement requirements of the rapid development of electronic equipment, the high-speed interconnection and transmission backplane bandwidth of the backplane ranges from 400G to 500G-1T bps. The current demand is to upgrade from the original 400Gbps N+N double-sided blind press backplane. The use of wiring space is becoming more and more compact, and the space utilization requirements are getting higher and higher. Since the assembly space of the circuit board in the equipment is usually fixed, the existing circuit board Dimensions such as the shape and width cannot be changed. The wiring space of the internal circuit of the circuit board can only meet the high-s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0047H05K3/4638H05K2203/0214
Inventor 王小平纪成光杜红兵焦其正金俠
Owner DONGGUAN SHENGYI ELECTRONICS
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