Chemo-mechanical grinding equipment

Abstract

The invention belongs to the technical field of semiconductor mechanical grinding equipment, in particular to a chemical mechanical grinding equipment. The grinding fluid supply position of the existing grinding fluid supply pipe is relatively single, and the centrifugal force of the rotation of the turntable alone cannot ensure the polishing of the grinding pad under the grinding head. The grinding liquid can be evenly distributed, and the uneven distribution of the grinding liquid will directly affect the grinding effect of the grinding head, resulting in uneven grinding results of the substrate and other shortcomings. The following scheme is proposed, a chemical mechanical grinding equipment, including a support base, The support base has a hollow structure, and the inner cavity of the support base is fixed with a first drive device through a bracket. The output shaft of the first drive device passes through the upper side wall of the support base and is connected with the turntable through a flange. The cross section of the turntable It is circular and has a rectangular vertical section. The chemical mechanical grinding equipment can make the object to be ground fully soaked by the grinding liquid, thereby making it evenly ground, improving the uniformity and flatness.

Description

technical field [0001] The invention relates to the technical field of semiconductor mechanical grinding equipment, in particular to chemical mechanical grinding equipment. Background technique [0002] With the rapid development of VLSI, the manufacturing process of integrated circuits has become more and more complex and sophisticated. In order to improve integration and reduce manufacturing costs, the feature size of components is getting smaller and the number of components per unit area of ​​the chip is increasing. It is difficult for planar wiring to meet the requirements of high-density distribution of components. Multilayer wiring technology can only be used to take advantage of the verticality of the chip. Space, and further increase the integration density of the device. However, the application of multilayer wiring technology will cause the surface of the substrate to be uneven, which is extremely unfavorable to the graphics production. Therefore, it is often nec...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problem that the grinding liquid supply position of the grinding liquid supply pipe on the chemical mechanical grinding equipment in the prior art is relatively single, and the centrifugal force of the rotation of the turntable alone cannot ensure that the grinding liquid on the grinding pad under the grinding head can be uniform. distribution, and the uneven distribution of the grinding liquid will directly affect the grinding effect of the grinding head, leading to the disadvantages of uneven grinding results of the substrate, and a chemical mechanical grinding equipment proposed

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