Embedding jig of module power supply and embedding device with embedding jig

Abstract

The invention discloses an embedding jig of a module power supply and an embedding device with the embedding jig. The embedding jig comprises a jig base and a jig main body, wherein the jig main body is rotatably connected on the jig base; and the jig main body is used for fixing the to-be-embedded module power supply. The embedding device comprises a feeding mechanism, a glue filling mechanism and the embedding jig, wherein the feeding mechanism is used for providing glue for the glue filling mechanism; the glue filling mechanism is used for performing embedding on the to-be-embedded module power supply; and the embedding jig is arranged below the glue filling mechanism. According to the embedding jig of the module power supply and the embedding device with the embedding jig provided by the invention, air in bubbles can be smoothly discharged during the embedding process, a cavity of the to-be-embedded module power supply can be completely filled with glue, and quality of the module power supply is guaranteed.

Description

technical field [0001] The invention relates to the field of potting technology, in particular to a potting jig for a module power supply and potting equipment with the potting jig. Background technique [0002] Due to the characteristics of short design cycle, high reliability and easy system upgrade, the modular power supply system is widely used in switching equipment, mobile communication, microwave communication, access equipment, optical transmission, routers and other communication fields and automotive electronics, In aerospace and other fields, especially in recent years, due to the rapid development of data services and the continuous promotion of distributed power supply systems, the application of module power supplies has become more and more extensive. With the extensive use of semiconductor technology, packaging technology and high-frequency soft switching, the power density of the module power supply is getting higher and higher, and the conversion efficiency...

AI Technical Summary

Problems solved by technology

With the extensive use of semiconductor technology, packaging technology and high-frequency soft switching, the power density of the module power supply is getting higher and higher, and the conversion efficiency is getting higher and higher; however, in order to realize high-power and high-density modules, the volume of the module power supply Small, and the electronic components are becoming more and more dense. At present, in order to achieve heat dissipation, pressure resistance, shockproof, waterproof and moisture-proof, high and low temperature environments, insulation, and its physical and electrical properties, it can only be potted and sealed, making it complicated. The structure and shape can be effectively protected for a long time

At present, in the process of potting the module power supply on the market, the rubber material cannot flow in the ideal direction, resulting in the encapsulation of the module power supply (especially the small gap and the position of the water chestnut) cannot be eliminated, resulting in the module during the potting process and after curing. There are air bubbles in the power supply, which will shorten the life of the module power supply or scrap it during use

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