Classification risk evaluation method of lamination defects of plastic packaging device

Abstract

The invention discloses a classification risk evaluation method of lamination defects of plastic packaging devices. The method comprises the steps of carrying out quality consistency analysis on the devices, and checking the surface quality and internal quality of the devices; according to a preset sample size, sampling in batches of the devices which pass the quality consistency analysis, so as to obtain one device to be evaluated; determining the type of the lamination defect of the device to be evaluated by using an ultrasonic scanning microscopy method; carrying out a moisture sensitivity rating test to determine the moisture sensitivity level of the device to be evaluated; determining the grade of the lamination defect of the device to be evaluated according to the type of the lamination defect and the moisture sensitivity level; carrying out an interface fatigue acceleration test on the device to be evaluated; generating a evaluation conclusion of the device to be evaluated according to a test result of the interface fatigue acceleration test. The method has the advantages of clear process, clear and definite criteria and easy implementation; the obtained evaluation result has an intuitive guiding value for the use of a user.

Description

technical field [0001] The invention relates to the technical field of detection and analysis of electronic devices, in particular to a hierarchical risk assessment method for delamination defects of plastic-encapsulated devices. Background technique [0002] Industrial / commercial plastic-encapsulated devices have been widely used in the fields of civilian electronics and industrial electronics due to the characteristics of lightness, miniaturization, and high packaging integration. However, due to the problems of hygroscopicity of materials and delamination defects of plastic packaging materials in industrial / commercial plastic packaging devices, various failure modes caused by water vapor infiltration are prone to appear in the actual use process, which seriously limits the inherent quality and long-term reliability of electronic products. . [0003] At present, for the problem of delamination defects of military-grade plastic-encapsulated devices, the international and d...

AI Technical Summary

Problems solved by technology

However, due to the problems of hygroscopicity of materials and delamination defects of plastic packaging materials in industrial / commercial plastic packaging devices, various failure modes caused by water vapor infiltration are prone to appear in the actual use process, which seriously limits the inherent quality and long-term reliability of electronic products.

[0003] At present, for the problem of delamination defects of military-grade plastic-encapsulated devices, the international and domestic component detection and analysis industries mainly use a single method of ultrasonic scanning microscope inspection for screening and elimination. The technical basis is the corresponding military standard, but for industrial / commercial grades The evaluation of plastic-encapsulated devices is too strict and not targeted, and it is prone to the problem of too strict judgment

At this stage, there is no effective evaluation method and approach in China to give a graded evaluation of the applicability, restriction or prohibition of plastic-encapsulated devices (especially industrial / commercial-grade plastic-encapsulated devices with delamination defects) in long-term use environments Conclusions severely limit the popularization and application of plastic-encapsulated devices in high-reliability fields such as automobiles, aviation, and aerospace

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