Pole plate structure, electrostatic driving structure using the pole plate structure and manufacturing method thereof

A plate structure, electrostatic drive technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problem of etching damping holes, etc., and achieve the effect of easy preparation and large electrostatic force/damping force ratio

Active Publication Date: 2019-04-30
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method is only suitable for two plates outside the plane (such as figure 1 As shown), and the plate on the opposite side, due to the technical level, it is impossible to etch the horizontal damping hole on the side wall, so another solution is needed

Method used

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  • Pole plate structure, electrostatic driving structure using the pole plate structure and manufacturing method thereof
  • Pole plate structure, electrostatic driving structure using the pole plate structure and manufacturing method thereof
  • Pole plate structure, electrostatic driving structure using the pole plate structure and manufacturing method thereof

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Effect test

Embodiment 1

[0056] The present invention provides a pole plate structure, please refer to figure 2 and image 3 , which are respectively shown as a top view and a perspective view of the pole plate structure 1. As shown in the figure, one side of the pole plate structure 1 is provided with at least one damping hole 101 penetrating the pole plate structure 1 up and down, wherein the damping The openings of the hole 101 on the side, upper surface, and lower surface of the pole plate structure are side openings 1011, upper openings 1012, and lower openings 1013, respectively, and the area of ​​the upper opening 1012 or the area of ​​the lower opening 1013 is larger than the area of ​​the lower opening 1013. The area of ​​the side opening 1011 is described above.

[0057] like Figure 4 As shown, it is a schematic diagram showing the relative movement of two movable parts adopting the pole plate structure of the present invention in the plane. The in-plane relative movement here refers to t...

Embodiment 2

[0065] The present invention also provides a method for manufacturing a pole plate structure, comprising the following steps:

[0066] like Figure 11 As shown, step S1 is performed: providing a substrate 201 , etching a cavity structure 203 in the substrate 201 , and forming an insulating layer 202 on the surface of the cavity structure 203 .

[0067] Specifically, the substrate 201 includes but not limited to Si, Ge, SiGe and other conventional semiconductor materials. The insulating layer 202 includes but not limited to compound materials such as silicon oxide and silicon nitride. In this embodiment, the substrate 201 is an example of a Si substrate, and the insulating layer 202 is an example of silicon oxide.

[0068] The cavity structure 203 can be obtained by dry or wet etching. The function of the cavity structure 203 is to provide a floating space for the subsequent formation of the suspended pole plate structure, and its shape is not limited.

[0069] like Figur...

Embodiment 3

[0078] The present invention also provides an electrostatic driving structure adopting any one of the pole plate structures in the embodiment.

[0079] Specifically, the electrostatic driving structure includes a movable electrode and a fixed electrode, and the movable electrode and the fixed electrode may be plate electrodes or interdigital electrodes.

[0080] As an example, the movable electrode and the fixed electrode move relative to each other in the same plane, and at least one of the movable electrode and the fixed electrode adopts the pole plate structure, that is, only the movable electrode The pole plate structure of the present invention is adopted, or only the fixed electrode adopts the pole plate structure of the present invention, and both the movable electrode and the fixed electrode may adopt the pole plate structure of the present invention.

[0081] As an example, such as Figure 15 As shown, it shows an electrostatic driving structure 3 using interdigitate...

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PUM

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Abstract

The invention relates to a polar plate structure, an electrostatic driving structure utilizing the polar plate structure and a manufacturing method thereof. One side of the polar plate structure is provided with at least one damping hole which passes through the polar plate structure from top to bottom, wherein the upper opening area or the lower opening area of the damping hole is larger than the area of the side opening. The damping hole is capable of being easily prepared by utilizing the prior art level. At the same moment, when the polar plate structure of the damping hole is used as a movable part of the surface and when relative motions of the movable part occur, the air between the two movable parts is no longer compressed due to confinement, but enters the damping hole through an air inlet with smaller area, and is released rapidly through the upper opening with larger area or the lower opening with larger area, so that damping forces are reduced. Because the side opening area of the damping hole is smaller, the damaged area of the polar plate area is not too large, the static electricity is not obviously reduced, and a larger electrostatic force ratio or a larger damping force ratio is obtained by utilizing the electrostatic driving structure of the polar plate structure.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical system actuators, and relates to a polar plate structure, an electrostatic driving structure using the polar plate structure and a manufacturing method thereof. Background technique [0002] In macroscopic machinery, the air damping is generally not considered because it is very small. However, as the scale of the device shrinks, the influence of the air damping becomes significant. In order to improve the performance of the device, it is necessary to try to reduce the effect of the air damping. Generally speaking, the use of vacuum packaging can effectively solve this problem, but vacuum packaging will lead to problems such as complex manufacturing process, high cost and poor flexibility. A problem that needs to be solved urgently. [0003] Die-film damping is a common type of damping in MEMS, and it has a great influence on the dynamic characteristics of microstructures with variable gaps...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B3/00B81C1/00
CPCB81B3/0021B81B3/0067B81C1/00166B81C1/00642
Inventor 熊斌刘松徐德辉马颖蕾
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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