Terahertz wave broadband absorbing material based on silicon nanoneedles
An absorbing material, silicon nanotechnology, applied in electrical components, antennas and other directions, can solve the problems of poor device stability, complex manufacturing process, high manufacturing cost, etc., and achieve the effects of low cost, simple manufacturing process and simple structure
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[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments, and the present invention is not limited to the embodiments.
[0024] The silicon nanoneedle-based terahertz wave broadband absorbing material provided in this embodiment has a structure such as figure 1 , figure 2 As shown, it includes silicon nanoneedle array and heavily doped silicon substrate.
[0025] The preparation process of the above absorbing material is described below with an n-type silicon nanoneedle array with a length of 15 μm:
[0026] Step 1: First cut the heavily doped n-type single crystal silicon wafer into a square of 15mm×15mm, then ultrasonically clean it with acetone of appropriate concentration, absolute ethanol and deionized water for 10 minutes, and then use high-pressure nitrogen Blow dry the silicon wafer;
[0027] Step 2: Put the cleaned silicon wafer into the pre-prepared AgNO 3 Soak in HF / HF solution for 60 m...
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