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Chip-on-board packaging method and chip-on-board packaging system

A chip packaging and chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of COB packaging requiring manual participation and low production efficiency, and achieve the effect of solving low production efficiency and improving production efficiency

Active Publication Date: 2019-04-30
QINGDAO JASON ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a chip-on-board packaging method and a chip-on-board packaging system, which solve the technical problem of low production efficiency in the existing COB packaging due to the need for manual participation in the wire bonding and encapsulation processes

Method used

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Embodiment Construction

[0023] The specific implementation manners of the present application will be described in further detail below in conjunction with the accompanying drawings.

[0024] Such as figure 1 As shown, the chip-on-board packaging method proposed in this application includes the following steps:

[0025] Step S11: adding conductive wires at the set position of the film; wherein, both ends of the conductive wires are embedded in the film, and the middle section of the conductive wires except the two ends protrudes above the film.

[0026] Fluorine resin is used as the material to make a film with a thickness of about 50 to 600 microns. In terms of film thickness control, if it is too thin, the oxidation resistance will be poor and the requirements for the process will be high. If it is too thick, the chip volume will be affected. The optimal thickness Controlled at 80 to 300 microns.

[0027] In the film-making process, it is necessary to add conductive wires at the set position. The...

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Abstract

The invention discloses a chip-on-board packaging method and a chip-on-board packaging system, which solves the technical problem that both wire bonding and packaging processes in the existing COB packaging require manual participation and lead to low production efficiency. Add a conductive line at the set position of the film, and ensure that the two ends of the conductive line are embedded in the film, and the middle section of the conductive line except the two ends protrudes above the film; cover the film on the substrate with the chip fixed, And calibrate so that the two ends of the conductive wire are respectively aligned with the set solder points on the chip and the substrate; the film is heated according to the set temperature and time, so that the film is deformed by heat and bonded to the surface of the chip and the substrate to achieve encapsulation , and after heating until the film is in a semi-fluid state, the two ends of the conductive wire sink and contact the corresponding solder joints to achieve wire bonding. This combination of wire bonding and encapsulation processes saves the steps of manual equipment wiring, which can significantly improve production efficiency.

Description

technical field [0001] The invention belongs to the technical field of COB packaging, and in particular relates to a chip-on-board packaging method and a chip-on-board packaging system. Background technique [0002] COB packaging (Chip on Board), is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to achieve electrical connection. Finally, in order to avoid contamination or artificial If the damage affects or destroys the function of the chip, it is necessary to encapsulate the chip and the bonding wire with glue. Among them, the wire bonding process is a method of using thin metal wires, using heat, pressure, and ultrasonic energy to tightly weld the metal wires to the substrate pads, so as to realize the electrical interconnection between the chip and the substrate and the information exchange between the chips. The encapsulation process is to attach resin, silica gel and other packaging mat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/62
CPCH01L33/48H01L33/52H01L33/62H01L2933/0033H01L2933/005H01L2933/0066H01L2224/8592H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 白生茂曲丞世张晓裴潘娜王洁武帅周德宝梁旭东
Owner QINGDAO JASON ELECTRIC
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