Fiber Bragg grating sensing and infrared sensing technology-based multi-physical field measurement system

Abstract

The present invention discloses a fiber Bragg grating sensing and infrared sensing technology-based multi-physical field measurement system. The system comprises a fiber Bragg grating sensing unit, an infrared thermal imager sensing unit, a data acquisition unit and a control processing unit; the fiber Bragg grating sensing unit comprises a fiber Bragg grating sensor and an optical fiber demodulator which are connected with each other, wherein the fiber Bragg grating sensor is attached to a workpiece to be measured, and the optical fiber demodulator is connected with the control processing unit; the infrared thermal imager sensing unit comprises an infrared thermal imager and a digital image acquisition card which are connected with each other, wherein the digital image acquisition card is connected with the control processing unit; the data acquisition unit includes a digital acquisition card with an input and output function, wherein the output end of the digital acquisition card is connected with the optical fiber demodulator and the infrared thermal imager, and the input end of the digital acquisition card is connected with the control processing unit; and the control processing unit includes an industrial personal computer and a software platform. With the fiber Bragg grating sensing and infrared sensing technology-based multi-physical field measurement system of the invention adopted, precision measurement of various kinds of physical fields in the vicinity of a cutting area during a machining process can be realized, and the research of a cutting mechanism is facilitated.

Description

technical field [0001] The invention belongs to the technical field of precision measurement, and more particularly, relates to a multi-physical field (temperature field / strain field / vibration) synchronous precision measurement system based on fiber grating and infrared dual sensing technology. Background technique [0002] The machining process is accompanied by complex mechanical and thermal coupling phenomena. Accurately measuring the temperature field, strain field and vibration (especially monitoring the chattering phenomenon during the machining process) during the machining process plays an important role in the mechanism research of the machining process. Existing processing temperature measurement methods mainly include thermocouple method, infrared thermal radiation method, fine powder coating method with known melting point, thermal coating method, etc.; while existing strain measurement techniques include moire fringe, thermoelastic stress analysis, laser speckle...

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Problems solved by technology

[0003] The above-mentioned existing measurement methods have the following problems: 1) most of the methods can only measure the average temperature in the cutting process or the temperature at a limited point position, and although many researchers have used the infrared thermal imager method to measure the temperature of the entire cutting process However, in the actual measurement process, the measurement accuracy of the infrared thermal imager is low, especially for the measurement of the processing temperature field of metal materials. The high reflectivity of the metal leads to a very low infrared emissivity, and the emissivity varies with 2) As a general strain field measurement method—digital image correlation method, its high-temperature thermal radiation interferes with the imaging of traditional high-speed digital cameras, and digital image correlation method What is obtained is the displacement field, and when it is transformed into a strain field, the measurement noise will inevitably be amplified; 3) Although from the perspective of the cutting mechanism, the temperature field, strain field, and vibration during the cutting process are a coupling and constantly transform each other The physical field process, but there is currently no data showing that some people have simultaneously measured these three fields from the perspective of measurement

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