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Liquid protective structure used for back surface of wafer

A protective structure and wafer technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of difficult removal of chemicals, and achieve the effect of convenient maintenance and replacement, and protection from damage

Active Publication Date: 2017-05-24
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the chemicals on the back of the wafer are difficult to remove, the object of the present invention is to provide a liquid protection structure for the back of the wafer

Method used

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  • Liquid protective structure used for back surface of wafer
  • Liquid protective structure used for back surface of wafer
  • Liquid protective structure used for back surface of wafer

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Embodiment Construction

[0024] The present invention will be described in further detail below with reference to the drawings.

[0025] In a complete development or cleaning process unit, the collection cup is used for chemical protection (to prevent splashing to the outside of the unit) and waste liquid collection, as well as for gas-liquid separation. Such as figure 1 As shown, the liquid protection structure of the present invention includes a collection cup and a vacuum chuck 5 in the collection cup that absorbs the wafer 4 and drives the wafer 4 to rotate. The collection cup and the vacuum chuck 5 are both installed in the process unit. The collection cup is divided into a collection cup outer cover 1 and a collection cup inner cover 2. The collection cup outer cover 1 is the outermost protective layer to completely isolate the process area and the non-process area; the collection cup inner cover 2 is located on the collection cup outer cover 1 The inside is used to separate gas and liquid, and at ...

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Abstract

The invention relates to a waterproof device for preventing contamination of the back surface of a wafer in the developing, cleaning and other process units of uniwafer wet process equipment, and particularly relates to a liquid protective structure used for the back surface of the wafer. The liquid protective structure comprises a collection cup and a vacuum sucking disc which is arranged in the collection cup and adsorbs the wafer and drives the wafer to rotate. The collection cup and the vacuum sucking disc are installed in the process units. The collection cup is divided into a collection cup external cap and a collection cup internal cap. A protective ring is installed on the collection cup internal cap. The internal circle of the protective ring is arranged below the wafer with working clearance reserved between the internal circle of the protective ring and the wafer. A gas nozzle support and a deionized water nozzle support which are installed in the process units are arranged below the protective ring. The deionized water nozzle support is provided with a deionized water nozzle which sprays deionized water to the working clearance. The gas nozzle support is provided with a gas nozzle which blows and then dries the back surface of the wafer. The liquid can be effectively prevented from entering the back surface of the wafer so as to achieve the objective of protecting the back surface of the wafer.

Description

Technical field [0001] The invention relates to a waterproof device for preventing contamination of the back of a wafer in the process units such as development and cleaning of a single-chip wet equipment, and in particular to a liquid protection structure for the back of a wafer. Background technique [0002] In single-chip wet processing equipment, wafers often need to use a large amount of developer or chemicals for development, cleaning and other process actions. A large amount of liquid will be left along the sidewalls to the back of the wafer, causing the backside to be contaminated or follow. The suction cup enters the vacuum system, causing damage to the vacuum pipeline, motor and other components. Therefore, after the process is completed, the chemicals need to be completely removed and cannot remain on the wafer. A common method is to rinse the front and back of the wafer with a large amount of DIW (deionized water), and then use high-speed rotation or nitrogen purge t...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67017
Inventor 张杨
Owner SHENYANG KINGSEMI CO LTD
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