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Buffing device and buffing method

A polishing device and technology for polishing surfaces, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of slow manual polishing and difficult personnel training, and achieve the effect of solving difficult personnel training and improving polishing speed.

Active Publication Date: 2017-05-24
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention relates to a polishing device and a polishing method thereof, which are used to meet the industry's requirements for surface roughness and solve the problems of slow manual polishing speed and difficult talent training
A pulsed laser source provides a pulsed laser

Method used

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  • Buffing device and buffing method
  • Buffing device and buffing method

Examples

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Embodiment Construction

[0057] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient for any person familiar with the related art to understand the technical content of the present invention and implement it accordingly, and according to the contents disclosed in this specification, claims and accompanying drawings, The related objects and advantages of the present invention can be easily understood by anyone skilled in the related art. The following examples are to further describe the viewpoints of the present invention in detail, but not to limit the scope of the present invention in any way.

[0058] The polishing method of the present invention will be described below. The polishing method of the present invention includes scanning a surface of a workpiece multiple times alternately along a moving path with a first pulsed laser with a first power and a second pulsed laser with a second power. Wherein, t...

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Abstract

The invention discloses a buffing device and a buffing method. The buffing method comprises a first pulse laser having first power and a second pulse laser having second power scan a surface to be buffed of a workpiece along a moving path repeatedly and alternately. The first power is different from the second power.

Description

technical field [0001] The invention relates to a polishing device and a polishing method thereof, in particular to a polishing device and a polishing method thereof which use two pulse lasers with different powers to alternately scan the surface to be polished of a workpiece. Background technique [0002] With the rapid development of the precision machinery industry, the industry's requirements for the surface roughness of precision machinery parts and precision molds for producing precision machinery parts have also increased significantly. At present, the traditional polishing method is mainly to polish by hand. The best achievable centerline average roughness (Ra) for hand polishing is about 0.3 microns (μm). [0003] However, the best centerline average roughness that can be obtained by manual polishing of precision mechanical parts or mold surfaces can no longer meet the requirements of the current industry. In addition, manual polishing has problems that are not eco...

Claims

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Application Information

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IPC IPC(8): B23K26/352B23K26/06B23K26/0622B23K26/082B23K26/064B23K26/12
CPCB23K26/0608B23K26/0622B23K26/064B23K26/082B23K26/123B23K26/3576
Inventor 陈园迪蔡武融
Owner IND TECH RES INST
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