Resin sealed module

Abstract

Provided is a resin sealed module having a good resin filling property and provided with a circuit board, wherein a bridge part is not broken even if the size of a common land electrode is reduced with a reduction in the size of a circuit component, and when a plurality of circuit components are mounted, a gap between the components can be ensured. The present invention can provide a resin sealed module having a good resin filling property and provided with a circuit board, wherein a bridge part (12) is disposed while being displaced in a predetermined displacement direction in a region in which mounting parts (11) face each other, and therefore even if the line width of the bridge part (12) is made larger than in the prior art, a self-alignment phenomenon can be appropriately generated in a reflow step, the bridge part (12) is not broken even if the size of a common land electrode (10) is reduced with a reduction in the size of a circuit component (5), and when a plurality of circuit components (5) are mounted, a gap between the components can be ensured.

Description

technical field [0001] The present invention relates to a resin-sealed module obtained by resin-sealing a plurality of circuit components mounted on a circuit board. Background technique [0002] Conventionally, for example, there has been provided a resin-sealed module including: a circuit board having a plurality of land electrodes formed on one main surface thereof; and a plurality of circuit components mounted on the land electrodes on one main surface of the circuit board. and a resin sealing layer provided to cover each circuit component on one main surface of the circuit substrate. The respective circuit components are respectively mounted on one main surface of the circuit board by connecting the external electrodes and the land electrodes with solder. [0003] In a resin-sealed module, the external electrodes of some circuit components among the plurality of circuit components may be set to the same potential. In this case, a plurality of external electrodes set t...

AI Technical Summary

Problems solved by technology

That is, since the circuit component 503 tends to move in the direction of the adjacent mounting portion 501 at the shortest distance due to the surface tension of the molten solder on the adjacent mounting portion 501, the circuit component 503 may be in contact with each other between the mounting portions 501. The position is shifted by moving in the direction of the adjacent mounting part 501 on the straight line L with the shortest distance.

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