Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pressure sensor chip and preparation method, and absolute pressure sensor chip

A pressure sensor and chip technology, which is applied in the measurement of fluid pressure, pressure difference measurement between multiple valves, fluid pressure measurement by changing ohmic resistance, etc., can solve the problem of small measurement range and low output signal that cannot meet the detection requirements, Problems such as high-pressure pressure measurement cannot be applied to achieve the effect of increasing the range

Active Publication Date: 2017-02-15
ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT
View PDF10 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, the existing large-range pressure sensor chip has a low output signal when measuring small pressure and cannot meet the detection requirements, while the small-range pressure sensor can meet the detection requirements of small pressure but cannot be applied to the measurement of high-pressure pressure, that is, the traditional pressure sensor chip There have always been technical difficulties in the small measurement range

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pressure sensor chip and preparation method, and absolute pressure sensor chip
  • Pressure sensor chip and preparation method, and absolute pressure sensor chip
  • Pressure sensor chip and preparation method, and absolute pressure sensor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] In order to solve the defect that differential pressure and absolute pressure cannot be measured synchronously in the prior art, the inventor of the present application integrated the differential pressure sensor chip and the absolute pressure sensor chip into one pressure sensor chip, and optimized the internal structure of the chip to increase the The measuring range of the pressure sensor chip makes the pressure sensor chip in this application, compared with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a pressure sensor chip and a preparation method, and an absolute pressure sensor chip. The pressure sensor chip includes a glass base, a silicon pedestal and a silicon diaphragm which are arranged in turn. The upper surface of the silicon pedestal is provided with a first cavity and a second cavity, and a through cavity connecting the second cavity and the lower surface of the silicon pedestal is arranged below the second cavity. The inner ring of the through cavity is located in the periphery of the inner ring of the second cavity and the distance between the inner ring and the outer ring of the through cavity is smaller than the distance between the inner ring and the outer ring of the second cavity. The silicon diaphragm is fixed to the upper surface of the silicon pedestal. An absolute pressure varistor and a first Wheatstone bridge outputting an absolute pressure signal are arranged at the region edge, corresponding to the first cavity, of the surface of the silicon diaphragm. A differential pressure varistor and a second Wheatstone bridge outputting a differential pressure signal are arranged at the region edge, corresponding to the second cavity, of the surface of the silicon diaphragm. The glass base is provided with a vent hole communicating with the through cavity and the outside of the glass base. The application has a large measuring range and can realize the synchronous measurement of differential pressure and absolute pressure .

Description

technical field [0001] The invention relates to the field of microelectronic machining, in particular to a pressure sensor chip and a preparation method. Background technique [0002] Pressure sensors are widely used in aviation, aerospace, navigation, petrochemical, automobile manufacturing and other fields. The pressure sensor belongs to the microelectromechanical piezoresistive sensor, that is, the sensor chip manufactured by using the piezoresistive effect of single crystal silicon through microelectronic machining technology. Existing pressure sensor chips are divided into differential pressure sensor chips and absolute pressure sensor chips, wherein the differential pressure sensor chip is used to measure the difference between two pressures. The absolute pressure sensor chip is used to sense absolute pressure and output the absolute pressure value. If it is necessary to realize the measurement of differential pressure and absolute pressure, it must be realized one b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22G01L9/04G01L13/06
Inventor 黄贤谢军潘锦峰
Owner ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products