High-ortho toughened phenolic foam material and preparation method thereof

Abstract

The invention discloses a high-ortho toughened phenolic foam material and a preparation method thereof. The high-ortho toughened phenolic foam material comprises, by mass, 60-70 parts of high-ortho phenolic resin, 15-25 parts of hydroxymethyl polyamide resin, 8-15 parts of a curing agent, 5-10 parts of an emulsifier, and 10-15 parts of a foaming agent. The high-ortho phenolic resin is adopted as a foamed resin main agent; hydroxymethyl polyamide resin is adopted as a chain extender and toughening component; the curing agent, the emulsifier, and the foaming agent are added; the mixture is well mixed, and is uniformly coated on non-woven fabric; cross-linking and foaming are carried out within 30min under a maintained temperature of 50-60 DEG C in a constant-temperature oven, such that the high-ortho toughened phenolic foam material is obtained. The high-ortho toughened phenolic foam material provided by the invention has the advantages of low curing temperature, high cohesive energy, low dreg rate, and good impact toughness.

Description

technical field [0001] The invention relates to a high-presence toughened phenolic foam material and a preparation method thereof, belonging to the field of preparation of building thermal insulation and energy-saving materials. Background technique [0002] Phenolic foam material is a thermosetting material formed by cross-linking, curing and foaming under high temperature conditions of expandable phenolic resin, curing agent, foaming agent and other additive components. Phenolic foam has excellent flame retardancy and good thermal insulation performance, and is widely used in the field of building insulation materials. [0003] At present, most of the phenolic resins used in phenolic foam materials are prepared under the catalysis of acid and alkali. Since the para-hydrogen of phenol is more active than the ortho-hydrogen under the conditions of acid and alkali catalysis, the para-hydrogen is first condensed with formaldehyde to form The para-methine bond-based phenolic r...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the defects of traditional thermosetting phenolic foams such as high curing temperature, low cohesive energy, poor toughness, high slag dropping rate, and poor impact toughness, the object of the present invention is to prepare a high-presence toughened phenolic foam material, which is oxidized with metal hydroxide The compound is used as a catalyst to prepare a high-adjacent phenolic resin, and the methylol polyamide resin is used as a chain extender and a toughening component to increase the molecular weight, cohesive energy and toughness of the molecular chain of the adjoining phenolic resin, and to improve the strength of the thermosetting phenolic foam. Impact toughness