Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for determining signal line reference layer

A signal line and reference layer technology, applied in the field of the determination method and system of the signal line reference layer, can solve the problems of high scrap rate of boards and reduction of signal lines, etc.

Active Publication Date: 2017-02-08
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF6 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when this method achieves the same impedance value, the line width of the signal line needs to be reduced. When the line width of the signal line is small, it may lead to a high scrapping rate of the board during production by the PCB manufacturer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for determining signal line reference layer
  • Method and system for determining signal line reference layer
  • Method and system for determining signal line reference layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0070] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

[0071] like figure 1 As shown, the embodiment of the present invention provides a method for determining a reference layer of a signal line, in which the line width range of the signal line is preset, and the method may include the following steps:

[0072] Step 101: Determine the attribute parameters of the printed circuit board, and determine the wir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and system for determining a signal line reference layer, and the method comprises the steps: setting a line width range of the signal line; determining attribute parameters of a printed circuit board, and setting a wiring layer and a resistance value corresponding to the signal line; according to the attribute parameters, the wiring layer and the resistance value, determining a reference layer when simulated line width of the signal line is in the line width range; when an interval laminating layer being arranged between the wiring layer and the reference layer, and according to the wiring position of the signal line on the wiring layer, performing hollowing operation on at least one interval laminating layer. According to the scheme, the signal line realizing more signal functions in a proper line width can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method and system for determining a signal line reference layer. Background technique [0002] With the continuous development of big data technology, users have higher and higher requirements for server functions. Therefore, in order to meet user needs, it is necessary to realize as many signal functions as possible within a limited structural space. [0003] In the prior art, when designing a high-density board, the thickness of the PP sheet of the printed circuit board (PCB) is generally reduced, so that the PCB can include more stacked layers in a limited structural space. , so as to realize more signal functions. [0004] However, when this method achieves the same impedance value, the line width of the signal line needs to be reduced. When the line width of the signal line is small, it may cause PCB manufacturers to have a high board scrap rate during product...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0002H05K3/0044H05K3/4697H05K2201/0776H05K2201/0929
Inventor 武宁李永翠
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products