Vacuum lock system and processing method of substrates by using same

Abstract

The invention discloses a vacuum lock system and a processing method of substrates by using same. The vacuum lock system comprises a chamber main body, and a substrate transfer support assembly and a substrate elevating assembly which are arranged in the chamber main body, wherein the chamber main body comprises a processing chamber and a substrate transfer chamber which are arranged to be stacked vertically, the processing chamber performs plasma processing on the substrates, the substrate transfer chamber is selectively connected with an atmosphere environment or a vacuum processing environment, the substrate transfer support assembly comprises a substrate support apparatus and a substrate rotation apparatus, discs on the substrate support apparatus are used for placing the substrates, the substrate rotation apparatus transfers the substrates between adjacent discs, and the substrate elevating assembly is arranged in the chamber main body in an elevating mode to drive the substrates to move between the processing chamber and the substrate transfer chamber. According to the invention, multiple substrates can be simultaneously carried rapidly and effectively, the carrying pressure of a manipulator is mitigated, the work efficiency is improved, and the output is increased.

Description

technical field [0001] The invention relates to a vacuum lock system and its processing method for substrates. Background technique [0002] In the manufacturing process of semiconductor devices, various vacuum processing chambers are usually used to perform specific treatments such as thin film deposition, etching, oxidation or nitridation, heat treatment, etc. on the semiconductor wafer as the substrate to be processed in a vacuum environment. On the other hand, transfer of semiconductor wafers from the outside to such a vacuum processing chamber is generally carried out by including a load lock device for switching the internal pressure between an atmospheric pressure state and a vacuum state. Generally, the load lock device is disposed between the vacuum transfer chamber and the outside of the atmospheric environment, such as a wafer cassette or factory interface. The vacuum transfer chamber is connected with each vacuum processing chamber to form an integrated vacuum p...

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Problems solved by technology

[0004] Although this load lock device has further improved its utilization efficiency, the manipulator of the robot will carry out the substrate transfer respectively to the load lock device and the plasma processing chamber of different heights, and for the vacuum processing chamber with a plurality of vacuum processing chambers As far as the processing device is concerned, if the utilization rate of the vacuum processing chamber is to be improved, it will undoubtedly impose a great burden on the work of the vacuum robot, and the work efficiency and output are greatly limited.

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