High-strength copper clad plate of symmetrically stacked structure and preparation method thereof

A high-strength, copper-clad laminate technology, used in chemical instruments and methods, other household appliances, electronic equipment, etc., can solve problems such as large deviation in product thickness, affecting product technical quality, waste and other problems

Active Publication Date: 2017-02-01
江门市龙兴电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is light, it will cause more overflow and cause waste, which will cause a large deviation in product thickness. If it is serious, it will pollute the production equipment and destroy the production environment. What is more, it will damage the equipment, which not only affects the technical quality of the product, It also reduces the service life of the equipment

Method used

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  • High-strength copper clad plate of symmetrically stacked structure and preparation method thereof
  • High-strength copper clad plate of symmetrically stacked structure and preparation method thereof
  • High-strength copper clad plate of symmetrically stacked structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] An embodiment of the present invention provides a method for preparing a symmetrically laminated high-strength copper-clad laminate, including the following steps:

[0073] Select copper foil and the first prepreg, the second prepreg, the third prepreg, and the fourth prepreg as shown in Table 1;

[0074] Table 1 Reinforcing material and glue content of each prepreg

[0075]

[0076] A copper foil, a first prepreg, a second prepreg, a third prepreg, four fourth prepregs, a third prepreg, a second prepreg, and a first prepreg are stacked in sequence, Then put them into a vacuum hot press machine for hot press molding to obtain copper clad laminates 1 respectively, wherein the parameter settings of the vacuum hot press machine are shown in Table 2.

[0077] Table 2 Hot press forming parameter setting table

[0078] Thermoforming parameters temperature (°C) Hold time (min) Pressure (kgf / cm 2 )

Embodiment 2

[0080] An embodiment of the present invention provides a method for preparing a symmetrically laminated high-strength copper-clad laminate, including the following steps:

[0081] Select copper foil and the first prepreg, the second prepreg, the third prepreg, and the fourth prepreg as shown in Table 3;

[0082] Table 3 Reinforcing materials and glue content of each prepreg

[0083]

[0084] Lay one copper foil, one first prepreg, one second prepreg, one first prepreg, four fourth prepregs, one first prepreg, one second prepreg, one first prepreg in sequence , and then placed in a vacuum hot press machine for hot press molding to obtain copper clad laminates 2 respectively, wherein the parameter settings of the vacuum hot press machine are shown in Table 4.

[0085] Table 4 Hot pressing forming parameter setting table

[0086]

[0087]

Embodiment 3

[0089] An embodiment of the present invention provides a method for preparing a symmetrically laminated high-strength copper-clad laminate, including the following steps:

[0090] Select copper foil and the first prepreg, the second prepreg, the third prepreg, and the fourth prepreg as shown in Table 3;

[0091] Table 5 Reinforcing material and glue content of each prepreg

[0092]

[0093] Lay one copper foil, one third prepreg, one second prepreg, one third prepreg, four fourth prepregs, one third prepreg, one second prepreg, one third prepreg in sequence , and then placed in a vacuum hot press for hot press molding to obtain copper clad laminates three respectively, wherein the parameter settings of the vacuum hot press are shown in Table 4.

[0094] Table 6 Hot press forming parameter setting table

[0095]

[0096]

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Abstract

The invention provides a high-strength copper clad plate of a symmetrically stacked structure and a preparation method thereof. Through the prepreg symmetrically stacked structure of a reinforcing material with different thicknesses, a thin sheet is placed in a middle in a stacking manner, but a thick sheet is stacked at an outer layer; in the condition of guaranteeing the quality of a copper clad plate, edge resin can be prevented from flowing out during heat pressing, a corner thickness is prevented from exceeding a tolerance range, and the thickness control ability of the copper clad plate is greatly increased; on the other hand, the strength of the copper clad plate obtained after hot press molding is far higher than that of an ordinary copper clad plate, moreover, the external surface of the obtained copper clad plate is quite smooth and flat, and the application requirement of the copper clap plate is met; what is noteworthy is that the high-strength copper clad plate of the symmetrically stacked structure and the preparation method thereof are applicable to various resin formulas and are high in universality, moreover, the preparation method is simple to operate, the quality risk is low, and the production can be continued; the efficiency is high, and the production benefit of an enterprise can be greatly improved.

Description

technical field [0001] The invention belongs to the technical field of production methods of copper-clad laminates, and in particular relates to a symmetrically laminated high-strength copper-clad laminate and a preparation method thereof. Background technique [0002] Copper Clad Laminate (Copper Clad Laminate, full name copper clad laminate, English abbreviation CCL), is made of glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot pressed. product. Copper clad laminate is the basic material of the electronics industry, mainly used for processing and manufacturing printed circuit boards (PCB). [0003] With the development of "light", "small", "thin" and "fast" terminal electronic products, circuit boards continue to develop in the direction of denser lines and thinner layers, so the impedance characteristics of transmission circuits and Reliability, component assembly and processing accuracy put forwa...

Claims

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Application Information

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IPC IPC(8): B32B17/02B32B17/12B32B17/06B32B17/04B32B15/20B32B37/06B32B37/10
CPCB32B5/26B32B15/14B32B15/20B32B37/06B32B37/1018B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2307/54B32B2307/734B32B2457/08
Inventor 曾金师李金梅黎忠良何庭玉
Owner 江门市龙兴电子材料有限公司
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