Flexible circuit board, circuit connection structure and mobile equipment

A flexible circuit board and circuit connection technology, used in circuit thermal devices, printed circuit components, etc., can solve problems such as inability to integrate, limited thickness of mobile devices, and large space, to improve integration, reduce occupied space, and achieve Effect of cooling function

Active Publication Date: 2017-01-11
YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These arrangements need to occupy a large space and cannot be integrated, which leads to the limitation of the thickness of the mobile device and cannot continue to be thinner.

Method used

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  • Flexible circuit board, circuit connection structure and mobile equipment
  • Flexible circuit board, circuit connection structure and mobile equipment
  • Flexible circuit board, circuit connection structure and mobile equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] refer to Figure 1-Figure 2 , this embodiment provides a flexible circuit board with both heat dissipation and conduction functions, including a conduction layer 11 and an insulation layer 12 . The surface of the conductive layer 11 is divided into a heat dissipation area 111 and a non-radiation area 112. The non-radiation area 112 is covered with an insulating layer 12, and the heat dissipation area 111 is covered with a heat dissipation metal layer 13, and the heat dissipation metal layer 13 is electrically connected to the conductive layer 11 located in the heat dissipation area 111. The two ends of the flexible circuit board 1 are conductive ends. The two ends of the flexible circuit board 1 are used as conductive ends, which can connect the parts that need to be electrically connected to realize the conductive function, and the heat dissipation metal layer 13 laid on the heat dissipation area 111 can realize the heat dissipation function and the conduction function...

Embodiment 2

[0037] refer to Figure 4-Figure 8, this embodiment provides a circuit connection structure, including a fixed area 2, an electronic device 3 to be dissipated and the above-mentioned flexible circuit board 1, and a first electrical connection part 21 and a second electrical connection part 21 to be electrically connected are arranged on the fixed area 2 Part 22, the two ends of the flexible circuit board 1 are fixed and electrically connected to the first electrical connection part 21 and the second electrical connection part 22 respectively, and the electronic device 3 to be dissipated is electrically connected to the heat dissipation metal layer 13 and dissipates heat through the heat dissipation metal layer 13. Specifically, the fixed area 2 is an area on which there are two or more than two electrical connection parts that need to be electrically connected. The fixed area 2 can be a certain component, such as a main board, etc., on which there are required electrical connec...

Embodiment 3

[0043] refer to Figure 6-Figure 8 , the present embodiment provides a mobile device, including the above-mentioned circuit connection structure, which saves layout space, improves the integration of electronic devices, and can also reduce the thickness. The fixed area 2 of this embodiment includes a middle frame 23 connected to the main ground and a metal frame 24 connected to the feed point of the antenna. The middle frame 23 is provided with a first electrical connection part 21, and the metal frame 24 is provided with a second Connecting part 22. Through the above-mentioned circuit connection structure, the connection between the antenna and the main ground is realized, and the grounding and heat dissipation of the electronic device 3 to be dissipated are also realized, which greatly improves the integration of the antenna and the electronic device 3 to be dissipated, and saves the layout space.

[0044] The electronic device 3 to be dissipated can be a camera module, the...

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PUM

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Abstract

The invention discloses a flexible circuit board with functions of heat dissipation and electric conduction, a circuit connection structure applying the flexible circuit board and mobile equipment. The flexible circuit board comprises a conducting layer and an insulating layer, and is characterized in that the surface of the conducting layer is divided into a heat dissipation area and a non heat dissipation area, the non heat dissipation area is covered by the insulating layer, a heat dissipation metal layer is laid in the heat dissipation area, the heat dissipation metal layer is electrically connected with the conducting layer of the heat dissipation area, and both ends of the flexible circuit board are conductive ends. According to the invention, both ends of the flexible circuit board serve as conductive ends, thereby being capable of connecting components requiring electric connection, and realizing the electric conducting function. The heat dissipation metal layer laid in the heat dissipation area not only can realize the heat dissipating function, but also can realize the electric conducting function. Electronic devices located on the heat dissipation metal layer are electrically connected to a circuit of the flexible circuit board, the integration level of the electronic devices is improved, and the space occupied by the electronic device is reduced.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board, a circuit connection structure and mobile equipment. Background technique [0002] At present, mobile devices are developing toward thinner and lighter. In order to make the thickness of the mobile device smaller, the arrangement of various electronic devices in the mobile device must be more and more compact, and it is developing towards the direction of integration. [0003] In existing mobile devices, the bottom of the camera module is smeared with heat-conducting silica gel to dissipate heat, which increases the height of the camera module, generally resulting in an increase in the height of the camera module, protruding from the shell of the mobile device, and affecting user experience. An antenna of an existing mobile device is generally connected to a main board through a shrapnel, and then connected to a main ground on the main bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0209
Inventor 杨斌峰
Owner YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
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