Flexible circuit board and manufacturing method thereof

Abstract

The invention relates to a flexible circuit board, which comprises a plurality of copper clad substrates, a line pattern, a plurality of bonding colloids corresponding to the plurality of copper clad substrates, and a plurality of conductive holes; each copper clad substrate is provided with an insulating base material and an outer-layer line; the line pattern comprises a linear signal line, two ground lines and two hollow areas; the two ground lines are arranged at two sides of the linear signal line and are parallel to each other; the plurality of copper clad substrates are located at two reverse sides of the line pattern; each bonding colloid is stacked between the line pattern and the corresponding copper clad substrate; a gel-free slot is formed in each bonding colloid; the slots of the plurality of bonding colloids and the two hollow areas form an air dielectric layer to coat the linear signal line; the slot of each bonding colloid is aligned at the linear signal line; and the linear signal line is spaced from the plurality of bonding colloids to form a suspended state. The plurality of conductive holes are electrically connected with the plurality of outer-layer lines and the two ground lines. The invention further relates to a manufacturing method of the flexible circuit board.

Description

Technical field [0001] The invention relates to a printed circuit board technology, in particular to a flexible circuit board and a manufacturing method of the flexible circuit board. Background technique [0002] figure 1 It is a schematic cross-sectional view of a conventional high-frequency signal line structure 100. The high-frequency signal line structure 100 includes two ground pattern layers 110, one signal line 120, two dielectric layers 130 and a plurality of conductive holes 150. Wherein, the dielectric layer 130 completely covers the signal line 120 so that the signal line 120 is disposed between the two ground pattern layers 110. [0003] figure 2 for figure 1 A layered three-dimensional schematic diagram of the mid- and high-frequency signal line structure 100. The conductive holes 150 are equidistantly distributed on both sides of the signal line 120 and conduct the ground pattern layers 110. In other words, through the plurality of ground pattern layers 110, the p...

AI Technical Summary

Problems solved by technology

In addition, Teflon and liquid crystal polymers are special materials with high material costs, and have even been monopolized by major material suppliers.

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