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Resin film encapsulating and gas channel arranging method in RFI molding

A resin film and air path technology, applied in the field of resin matrix composite liquid molding, can solve the problems affecting the quality of the outer surface of the siding, and achieve the effects of avoiding resin residue accumulation, avoiding dry spots, and ensuring flatness.

Active Publication Date: 2017-01-04
AVIC COMPOSITES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of infiltration method, because the resin film is placed between the bottom mold and the preform, affects the quality of the outer surface of the wall panel

Method used

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  • Resin film encapsulating and gas channel arranging method in RFI molding
  • Resin film encapsulating and gas channel arranging method in RFI molding
  • Resin film encapsulating and gas channel arranging method in RFI molding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Example 1: figure 1 The wall panel structure with hat-shaped ribs is shown, and the hat-shaped ribs and the skin are integrally formed by the RFI process. For the molding of this structure, resin infiltration is required in the flange area of ​​the hat ribs. In order to achieve resin infiltration and ensure the quality of the exterior surface of the wall panel, the resin film encapsulation method and air path setting method proposed in this solution are adopted, as follows:

[0048] (a) The dry fiber areas of the preform 1 that require resin infiltration are the cap rib flange area and the root R corner area. The resin film placement area is selected according to the contour edge line of the cap rib flange area, and the distance from the contour edge line Offset 0~30mm outwards, and offset 0~5mm outwards according to the upper tangent of the R angle.

[0049] (b) Punch through holes in the cap rib mold of the resin film placement area of ​​the mold 3-2 on the inner side of t...

Embodiment 2

[0059] Example 2: image 3 In the structure of the stiffened wall panel shown, the stiffener and the skin are integrally formed by the RFI process. For the molding of this structure, resin penetration is required in the skin area. In order to ensure the quality of the exterior surface of the wall panel, the resin film encapsulation method and air path setting method of this scheme are adopted, as follows:

[0060] (a) The resin film placement area of ​​the preform 1 is the skin area. In order to avoid package bridging, the package edge of the R corner area is selected to offset the tangent inward by 0~5mm on the R corner.

[0061] (b) Punch through holes in the skin area of ​​the molds 3-1 and 3-2 on the inner side of the wall plate. The edge of the punched area is offset from the edge of the resin film placement area by 5mm to 10mm, the hole diameter does not exceed φ2mm, and the hole spacing is 15mm. After the mold preparation is completed, it is assembled with the preform.

[006...

Embodiment 3

[0071] Example 3: The siding skin with a sunken area on the exterior surface is formed by the RFI process. The skin area needs to be infiltrated with resin. In order to ensure the quality of the outer surface of the wall panel, the resin film is laid on the inner side of the wall panel, and the resin film encapsulation method and air path setting method of this scheme are adopted, as follows:

[0072] (a) The dry fiber area of ​​the preform that requires resin infiltration is the siding skin area, and the resin film laying area is based on the edge line of the skin contour.

[0073] (b) Punch through holes in the mold 3 on the inner side of the wall plate. The edge of the punching area is offset inward from the edge of the resin film placement area by 5mm-10mm, the hole diameter does not exceed φ2mm, and the hole spacing is 15mm. After the mold preparation is completed, it is assembled with the preform.

[0074] (c) Design an air path between the external profile surface of the pref...

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Abstract

The invention belongs to a resin-based composite liquid molding technique, relates to a resin film encapsulating and gas channel arranging method in RFI molding, and provides a gas channel arranging and resin film encapsulating method for an improved RFI technology. According to the method, in an area, needing resin infusion, of a wallboard, a resin film is encapsulated on the surface of a mold on the inner side of the wallboard by adopting an adhesive guide material, sealing strips and an isolating film; by arranging a gas channel between a wallboard preform and the mold to guide resin to permeate from top to bottom, complete wetting of the resin on the preform is achieved, and dry spots are avoided; good matching can be achieved when the wallboard preform and the mold are assembled, wallboard preform fiber deformation caused by resin flow in the resin laying and transferring process is avoided, and complete wetting of the resin on the preform is achieved on the premise of ensuring the quality of the inner surface and the outer surface of the wallboard.

Description

Technical field [0001] The invention belongs to a resin-based composite material liquid molding technology, and relates to an RFI molding resin film encapsulation and a gas path setting method. Background technique [0002] Composite resin film infusion (Resin Film Infusion, RFI) molding technology is to use dry fibers to prepare fiber preforms. During mold assembly, the resin film and dry fiber preforms are packaged together. The resin is melted, and under the action of vacuum and pressure, the resin flows to complete the infiltration of the fibers of the preform, and the composite material is obtained by curing at elevated temperature. The encapsulation of the resin film and the gas path setting are the key links of the RFI process. [0003] The traditional resin film permeation molding method of composite materials is to prepare the required resin into a resin film and place it on the bottom layer of the cavity between the preform and the mold, and use sealing strips and tape t...

Claims

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Application Information

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IPC IPC(8): B29C70/48B29C70/44
CPCB29C70/443B29C70/446B29C70/462B29C70/48
Inventor 高艳秋王海雷
Owner AVIC COMPOSITES
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