Separable type flexible substrate and manufacturing method thereof

A technology of flexible substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as high cost and cumbersome manufacturing procedures

Inactive Publication Date: 2016-12-21
TAIMIDE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for the above-mentioned flexible substrate with a release layer and its manufacturing method, when it wants to make a flexible substrate, it is necessary to make a release layer first, and its manufacturing procedure is relatively cumbersome and the cost is high.

Method used

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  • Separable type flexible substrate and manufacturing method thereof
  • Separable type flexible substrate and manufacturing method thereof
  • Separable type flexible substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A method for preparing a releasable flexible substrate.

[0030] Preparation of the first polyamic acid solution

[0031] Put 52.63 grams of ODA and 440 grams of DMAc as a solvent into a three-necked bottle, and then add 57.4 grams of PMDA after stirring until completely dissolved, wherein the monomer accounts for 20 wt% of the total weight of the reaction solution. Then, keep stirring at 25° C. and react for 25 hours. After the reaction, 1 wt % silane compound and 10 wt % siloxane compound are added to obtain the first polyamic acid solution.

[0032] Preparation of the second polyamic acid solution

[0033]Put 71.67 g of TFMB and 412.5 g of DMAc as a solvent into a three-neck flask, stir until completely dissolved, then add 65.84 g of BPDA, wherein the monomer accounts for 25 wt% of the total weight of the reaction solution. Then, the second polyamic acid solution can be obtained by continuously stirring and reacting at 25° C. for 25 hours.

[0034] Polyimide layer...

Embodiment 2

[0040] The steps of Example 1 were repeated, but the components of the first polyamic acid solution were changed to 3 wt% silane compound and 10 wt% siloxane compound.

Embodiment 3

[0042] The steps of Example 1 were repeated, but the components of the first polyamic acid solution were changed to 5 wt% silane compound and 10 wt% siloxane compound.

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Abstract

The invention provides a detachable flexible substrate and a manufacturing method thereof, which includes a support carrier; a release layer attached to the support carrier, which includes polyimide, silane, which constitute the main structure of the release layer compound and siloxane compound, the silane compound accounts for 1-10wt% of the total weight of the release layer, the siloxane compound accounts for 5-45wt% of the total weight of the release layer, and the polyimide consists of diamine and Formed by the reaction of dianhydride; a polyimide layer is formed by the reaction of diamine and dianhydride, which is attached to the release layer, wherein the siloxane compound is used to improve the contact between the polyimide layer and the The release force of the release layer, the silane compound is used to improve the adhesion between the release layer and the support carrier, so that the adhesion between the release layer and the support carrier is greater than the adhesion between the polyimide layer and the release layer degree, so that the polyimide layer can be peeled off from the release layer, while the release layer is still attached to the support carrier.

Description

technical field [0001] The invention relates to a detachable flexible substrate and a manufacturing method thereof, in particular to a flexible substrate applied to electronic components. The flexible substrate can be peeled off from a support carrier to obtain a flexible substrate with electronic components. Background technique [0002] Existing flat-panel displays use heavy and fragile glass substrates, which have been gradually replaced by plastic flexible substrates due to considerations of thinning and cost reduction, and the manufacture of plastic flexible substrate displays includes a support carrier to be formed on the support carrier The plastic flexible substrate on the substrate and the integrated circuits or various electronic circuits formed on the flexible substrate are then subjected to a peeling procedure to separate the flexible substrate from the supporting carrier to obtain a plastic flexible substrate display. [0003] There is an existing way to separat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683C08G73/10
CPCH01L21/6835C08G73/1007C08G73/1067C08G73/1071H01L2221/68386
Inventor 黄彦博蔡宗宪
Owner TAIMIDE TECH
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