Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible array substrate and preparation method thereof, and flexible display device

A flexible array and flexible substrate technology, applied in the field of flexible display devices, can solve problems such as cracking, poor connection performance, and falling off, and achieve the effects of improving falling off or cracking, enhancing connection performance, and improving flexibility

Active Publication Date: 2016-11-30
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
View PDF3 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bending of the flexible array substrate has less damage to the organic and metal materials, but the damage to the less flexible inorganic oxide is relatively serious, especially when it is bent to a small radius of curvature, it is easy to cause the above-mentioned Failures such as cracking and delamination of flexible array substrates of inorganic oxides
For the gate insulating layer 8, the gate insulating layer 8 can be patterned to reduce its coverage area to reduce stress, reduce cracking and peeling dislocation problems, but the mutual bonding between the interlayer dielectric layer 9 and the buffer layer 2 The area is large, and the connection performance between the two is poor. When the flexible array substrate is bent, the interlayer dielectric layer 9 is easy to fall off or break from the buffer layer 2, which affects the quality of the flexible array substrate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible array substrate and preparation method thereof, and flexible display device
  • Flexible array substrate and preparation method thereof, and flexible display device
  • Flexible array substrate and preparation method thereof, and flexible display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of the present invention shown in the drawings and described in accordance with the drawings are merely exemplary, and the present invention is not limited to these embodiments.

[0032] Here, it should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only the structure and / or processing steps closely related to the solution according to the present invention are shown in the drawings, and the Other details not relevant to the present invention.

[0033] This embodiment first provides a flexible array substrate, such as figure 2 As shown, the flexible array substrate includes a flexible base 10 and a buffer la...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a flexible array substrate which comprises a flexible pedestal and a buffering layer arranged on the flexible pedestal, wherein a plurality of thin film transistors are arranged on the buffering layer in an array manner; inter layer dielectrics are arranged on the thin film transistors, and cover the buffering layer; interconnection structural members are arranged between the inter layer dielectrics and the buffering layer; at least one interconnection structural member is correspondingly arranged on each of two sides of each column of thin film transistors; and the interconnection structural members extend towards the direction parallel to a bent shaft of the flexible array substrate. The invention further discloses a preparation method of the flexible array substrate and a flexible display device comprising the flexible array substrate. By the arrangement of the interconnection structural members, the connection performance of the interconnection structure layer in the flexible array substrate is improved, the problem of falling off or breakage of the interconnection structure layer is solved, and the quality of the flexible array substrate is improved.

Description

Technical field [0001] The present invention relates to the technical field of displays, in particular to a flexible array substrate and a preparation method thereof, and also to a flexible display device including the above flexible array substrate. Background technique [0002] Flat-panel display technology has developed rapidly in the past decade, and both the size of the screen and the quality of the display have made great progress. With its bendable characteristics, flexible display devices can be used in many fields that require curved display, such as smart cards, electronic paper, smart labels, and various fields where traditional flat panel display devices can be applied. Flexible display devices are bound to be in the future display product market With its dreamy and beautiful appearance, China has occupied a huge market share. Generally, a flexible display device includes a flexible array substrate and an electroluminescent device arranged in a stack, and a transpare...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77H01L27/32
CPCH01L27/1218H01L27/1259H10K59/12Y02E10/549H01L29/78603H01L27/1244Y02P70/50H10K59/124H10K59/131H10K77/111H10K2102/311H10K10/468H10K50/15H10K50/16H10K50/81H10K50/82H10K71/00
Inventor 秦芳
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products