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Circuit board outer box with water-proof and dust-proof functions

A waterproof and dustproof, circuit board technology, applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, chassis/cabinet/drawer parts, etc. Affecting heat dissipation performance and other issues

Pending Publication Date: 2016-11-23
ANHUI WANTONG POSTS & TELECOMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the rigid circuit board is prone to short circuit and cause failure when it is sprayed with water. In addition, dust adhesion also affects the heat dissipation performance.
Although the method of opening heat dissipation meshes on the outer box above the circuit board can achieve the purpose of heat dissipation, the risk of water and dust covering the surface of the circuit board is greatly increased

Method used

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  • Circuit board outer box with water-proof and dust-proof functions
  • Circuit board outer box with water-proof and dust-proof functions
  • Circuit board outer box with water-proof and dust-proof functions

Examples

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Embodiment Construction

[0013] The invention provides a circuit board outer box with waterproof and dustproof functions. In order to better understand the technical solutions of the present invention, the implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] See attached figure 1 , attached figure 2 And attached image 3 , a circuit board outer box with waterproof and dustproof functions, including a box cover 100, a box body 200, the box cover 100 is provided with a heat dissipation mesh 101, and also includes a protective shed 300, the protective shed 300 is connected by a connecting end 301 , a frame 302 and water-retaining and dust-proof blades 303; the connection end 301 is connected to the top of the frame 302, the water-retaining and dust-proof blades 303 are fixed inside the frame 302, and the water-retaining and dust-proof blades 303 are equidistantly distributed in parallel inside the frame 302, and Adja...

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Abstract

The invention relates to protection of electronic products, in particular to a circuit board outer box with water-proof and dust-proof functions. The problem that a circuit board below heat-dissipation holes is lack of water-proof and dust-proof technical measures in the prior art is solved by arrangement of a protective shed below heat-dissipation meshes and above the circuit board. The protective shed is positioned under the heat-dissipation meshes. When water falls, the fallen water is guided to two sides by water-proof and dust-proof blades on the protective shed, and prevented from falling on the circuit board below the protective shed, thereby achieving a waterproof effect. Meanwhile, dust adheres to the water-proof and dust-proof blades after falling, thereby playing a role in protecting the circuit board, and achieving a certain dust-proof effect. The water-proof and dust-proof blades are distributed in a border at equal intervals, so that the heat-dissipation effect of the circuit board is not influenced.

Description

technical field [0001] The invention relates to the protection of electronic products, in particular to a circuit board outer box with waterproof and dustproof functions. technical background [0002] Rigid (Rigid) circuit board is a printed circuit board made of polyester glass felt laminated board or epoxy glass cloth laminated board as the base material. It has the advantages of high wiring density, strong reliability, fast transmission speed, and convenient maintenance. It is mainly used in mobile phones, computers, air conditioners, automobiles, aerospace and military fields. Because the material is copper foil substrate, the conductivity is good. [0003] At present, most of the heat dissipation of electronic equipment is realized by air cooling. The performance of the air cooling system is very important to the stable operation of electronic equipment. The air cooling process generally uses fans to draw air to promote air convection to remove heat. At the same time,...

Claims

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Application Information

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IPC IPC(8): H05K5/02
CPCH05K5/0213H05K5/03
Inventor 赵从林
Owner ANHUI WANTONG POSTS & TELECOMM CO LTD
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