Metal-molybdenum-based microrelay and preparation method thereof

Abstract

The invention relates to a metal-molybdenum-based microrelay and a preparation method thereof. The metal-molybdenum-based microrelay comprises a single-end clamped cantilever beam which acts as an elastic reset structure, an electrostatic driving comb structure which is connected with the a single-end clamped cantilever beam and a contact which is close to one end of the a single-end clamped cantilever beam. The material of the single-end clamped cantilever beam, the comb structure and the contact is metal molybdenum. Metal molybdenum acts as donor material to design the electrostatic driving microrelay for the first time so that the problem of contact resistance can be greatly solved and system failure can be reduced. The metal-molybdenum-based microrelay has high reliability and can be widely applied to the field of consumptive electronics, medical health care, automobile industry, industrial automation and robots, aerospace and the internet of things.

Description

technical field [0001] The invention belongs to the technical field of relays, and in particular relates to a metal molybdenum-based micro-relay and a preparation method thereof, which can well solve the problem of contact resistance and improve the reliability of the micro-relay. Background technique [0002] The relay is an automatic control element that switches the on and off state of the circuit. Its functions mainly include expanding the control range, amplifying the sensitivity, remote control and monitoring signals, etc. It is widely used in communication, computer, automobile, industrial control, household appliances and other electronic controls. In the system, it is one of the essential basic components of the circuit control system. In aerospace vehicles, military equipment and other equipment, relays of various specifications are also used according to needs. In this case, the requirements for them are not only large current when closed, small contact resistance...

AI Technical Summary

Problems solved by technology

[0003] Traditional micro-relays use silicon as the structural material and metal as the contact part, which has problems such as complex processing technology and low reliability.

Due to the use of silicon and other materials as structural materials, the material itself has poor electrical conductivity, so it is necessary to form an additional layer of metal on the contact surface, such as using local electroplating, sputtering, evaporation, or using special processes such as Shadow Mask, but all of them increase The complexity of the process, and working for a long time may lead to contact failure, including the inability to turn off due to contact point fusion and the contact resistance surge or even insulation caused by contact degradation. The failure problem is especially serious when transmitting large currents

In addition, the inherent shortcomings of materials such as silicon prevent them from being widely used in harsh environments such as high temperature, high impact, high overload, and corrosiveness.

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