Novel surface-mounted inductor

Abstract

The invention discloses a novel surface-mounted inductor which comprises a base, an I-shaped magnetic core located on the upper surface of the base, and a coil winding arranged on the magnetic core, wherein one end of the magnetic core is adhered to the upper surface of the base with pins PIN; the pins PIN of the base are welded with the terminals of the coil winding; gaps are formed in black plastic positions at the pin-free ends of the base; and electric spark lines are formed on the surface, bonded with the magnetic core, of the base. By the adoption of the structure, the product quality and the production efficiency of the surface-mounted inductor are improved.

Description

technical field [0001] The invention belongs to the technical field of electronic components, in particular to a novel chip inductor. Background technique [0002] With the rapid development of the electronic information industry, SMD electronic components are widely used. SMD inductors are one of them. At present, the SMD inductors on the market include a base with an I-shaped magnetic core on the base. There is a coil winding on the magnetic core. One end of the magnetic core is pasted on the base with PIN feet. , the 4 PIN feet of the base are welded to the ends of the coil winding. During use, it was found that this kind of chip inductor has the following problems: first, the PIN pins are not completely formed after soldering, and the product is stuck in the material tape during production and cannot be taken out, which seriously affects the quality of the chip inductor; second, the PIN of the base The black injection molding layer on the upper part of the PIN foot at ...

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Problems solved by technology

During use, it was found that this kind of chip inductor has the following problems: first, the PIN pins are not completely formed after soldering, and the product is stuck in the material tape during production and cannot be taken out, which seriously affects the quality of the chip inductor; second, the PIN of the base The black injection molding layer on the upper part of the PIN foot at the foot gap is thin, and the black injection molding is damaged and torn when the PIN foot is formed. Although the PIN foot forming equipment is adjusted to reduce the molding force, the effect is minimal; the third is the material of the magnetic core and the base Different thermal expansion coefficients are not the same, so the magnetic core and the base are easy to loose after receiving the transfer of welding heat. Although the amount of adhesive is increased during the production process to increase the viscosity of the colloid, it has little effect

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