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Fabrication method of covering film and protective electromagnetic wave shielding film rigid-flex printed circuit board

A kind of rigid-flexible board and technology of making method

Active Publication Date: 2016-11-09
HUIZHOU KING BROTHER CIRCUIT TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is easy to appear during the total pressure process: under high temperature and high pressure, the PET protective film on the outer layer of the electromagnetic wave shielding film becomes brittle and cannot be torn off, resulting in scrapping; if the PET protective film is torn off in advance and then pressed together, the FR4 rigid board under high pressure Adhere to the insulating layer of the electromagnetic wave shielding film, and damage the appearance and performance of the electromagnetic wave shielding film after the cover is removed

Method used

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Embodiment Construction

[0033] In order to enable those skilled in the art to better understand the technical solution of the present invention, the product of the present invention will be further described in detail below in conjunction with examples.

[0034] The invention discloses a method for manufacturing a rigid-flex board with a covering film protecting an electromagnetic wave shielding film, which comprises the following steps:

[0035] A. Lamination structure design. The cover film is quickly pressed on the rigid board of the laminate structure. The cover film is arranged on the front and back of the high-frequency circuit board, and the outermost cover film is covered with FR4 glass fiber board.

[0036] B. For the production of flexible board circuit graphics, the inner layer core board cutting, circuit production, AOI inspection, browning, quick pressing of cover film, plasma treatment are carried out according to the conventional process, and the electromagnetic wave shielding film is w...

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Abstract

The invention discloses a fabrication method of a covering film and protective electromagnetic wave shielding film rigid-flex printed circuit board. The method comprises the steps of laminated stack design, flexible board circuit pattern fabrication, flexible board electromagnetic wave shielding film quick pressing, rigid board circuit pattern fabrication, rigid board covering film fast pressing, press-forming, subsequent procedure processing and the like. The fabrication method of the covering film and protective electromagnetic wave shielding film rigid-flex printed circuit board of the of the invention has the advantages of low cost, stable performance and strong processability.

Description

technical field [0001] The invention relates to the technical field of printed circuit board technology, in particular to a method for manufacturing a rigid-flex board with a covering film protecting an electromagnetic wave shielding film. Background technique [0002] The rigid-flex board has the characteristics of being bendable and foldable, meets 3D assembly, reduces the space occupied by the system, and is widely used in consumer electronics, industrial control, and medical automotive electronics. However, in the face of more and more complex circuit designs, the number of components is increasing, and the wiring is dense, forming electromagnetic interference with each other, which affects signal transmission and product applications. At present, in order to solve the noise generated by the internal wiring and components of the rigid-flex board and the external electromagnetic noise, the industry mainly uses the following methods to solve the electromagnetic radiation p...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4691H05K2203/06
Inventor 林启恒武守坤陈春林映生潘湛昌胡光辉李光平
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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