A large-size sapphire crystal boat transfer device

Abstract

The invention provides a large-size sapphire boat transfer device, which comprises an assembly platform, a piece push mechanism and a boat loading protection mechanism, wherein the assembly platform is provided with a boat positioning mechanism and a wafer support mechanism; the piece push mechanism comprises a slide bar, a slide block, a handle, a push rod and a piece push bracket; the boat loading protection device comprises a positioning lever, a lever groove, a connecting rod, a connecting rod through hole, a movable button, a movable button spring and a movable button groove. By the wafer transfer device provided by the invention, the risks of human contact, man-made pollution, drop breakage and the like caused in the wafer transfer process can be effectively reduced. A wafer is transferred in a manner of point contact of an insulating material and the wafer all the way when transferred, and the contact of a human body and the wafer is completely avoided, so that the man-made pollution is avoided from the source.

Description

technical field [0001] The invention relates to a transfer device, in particular to a large-size sapphire crystal boat transfer device. Background technique [0002] As the main material of LED, sapphire substrate material, the surface cleanliness has always been the focus of the industry. Although we have continuously improved the level of technology and process, the level of cleanliness has been greatly improved. But what has always troubled everyone is that the sapphire substrate needs to be manually inspected before packaging, and there is inevitably the problem of wafer contamination caused by the transfer of the wafer around the wafer. At the earliest, the back of the 2-inch wafer can be sucked by a vacuum pen to avoid dirt on the use surface. pollution problem. However, with the continuous development of science and technology, 6-inch substrates or even larger sapphire substrates have been widely used in the industry; [0003] The 6-inch substrate has a large area ...

AI Technical Summary

Problems solved by technology

[0003] The 6-inch substrate has a large area and heavy weight, and the transfer is very inconvenient, and the efficiency is low, and the risk of damage is high; especially in the process of processing, the wafers are frequently changed during the process, and broken and dropped frequently occur, resulting in large losses , low yield

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