BGA dismounting-to-welding tool used for printed board clamping and using method for BGA dismounting-to-welding tool

Abstract

The invention relates to a BGA dismounting-to-welding tool used for printed board clamping and a using method for the BGA dismounting-to-welding tool. The using method is characterized by adopting a first clamping way and a second clamping way, wherein the first clamping way is as follows: one side of a printed board is inserted into two clamping devices I on a guide rail at a fixed end, the other side of the printed board is inserted into two clamping devices II on a mobile sliding guide rail, and the printed board is fastened on the fixed-end guide rail and the sliding guide rail without dropping. The second clamping way is as follows: four mounting holes of the printed board are separately sleeved by two clamping supporting posts I and two clamping supporting posts II, i.e., the printed board is fastened on the fixed-end guide rail and the sliding guide rail. Two printed board supporting devices are arranged in rectangular slots of a chassis, so that the printed board supporting devices just support the middle positions of the printed board. The BAG dismounting-to-welding tool used for printed board clamping has the beneficial effects that: the middle part of the printed board is downwards bent and deformed as a result of applying force to the lower side when a BGA chip on the printed board is welded instead of being dismounted subsequently, so that repair progress of a BAG apparatus is guaranteed.

Description

technical field [0001] The invention relates to a BGA dismantling and refitting tool for clamping printed boards and a method of use thereof, which is a tooling fixture used for manually scraping solder paste before dismantling BGA components on a printed board and rewelding. Background technique [0002] For the printed board assembly workshop, when the printed board BGA device needs to be manually disassembled due to damage and other reasons, due to the specificity of the BGA device package and pad, it is generally necessary to manually make a BGA resoldering fixture through manual scraping of solder paste. After that, use the BGA rework bench for BGA soldering. In the process of manually scraping the solder paste, it is necessary to keep the printed board level and fixed, and the BGA resoldering fixture is closely attached to the printed board surface. Solder paste, so as to ensure that the position of the solder paste is accurate when it is attached to the pad, it does ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the disadvantages of the prior art that the clamping position of the printed board is too high, it is inconvenient to frequently apply force downwards, and there is no support in the middle of the printed board, which may easily cause the printed board to bend and deform. The BGA dismantling and welding tooling for clamping printed boards and its use method can quickly clamp printed boards of various sizes, the height of the tooling is low, and the middle part can support the tooling fixture of printed boards

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