Air-cooled heat radiating module for high-power IGBT parallel connection

Abstract

The invention discloses an air-cooled heat radiating module for high-power IGBT parallel connection, comprising two identical radiators, a fan, a sealing air duct structural component, and two radiator side sealing air duct structural components. The two radiators are installed in a mirror symmetry mode. The radiator side sealing air duct structural components are connected with the sides of the two radiators, and coat the two radiators into a tubular hollow module. Each radiator is equipped with one IGBT, and the IGBTs on the two sides of the tubular hollow module are installed in a mirror symmetry mode. The installation axis of the fan overlaps with the central axis of the tubular hollow module, and the fan blows air to the radiators. One end of the sealing air duct structural component is sleeved with the tubular hollow module, and the other end matches the size of the air outlet of the fan and makes the air outlet of the fan and the air duct of the tubular hollow module in sealing connection. The structure is simple and reasonable, and can meet the heat radiating demand of an application scenario of high-power IGBT parallel connection.

Description

technical field [0001] The invention relates to an air-cooled and heat-dissipating module, in particular to an air-cooling and heat-dissipating module that achieves parallel IGBTs with the same heat dissipation conditions through a symmetrical design. Background technique [0002] In high-power power electronics applications such as wind power, solar energy, high-voltage frequency conversion, and power quality management, because the current development of IGBT semiconductor device technology cannot meet the needs of product capacity, the application of IGBT parallel technology to improve system capacity is becoming more and more extensive. Only by ensuring good current sharing characteristics can the IGBT parallel system have good reliability and economy. In order to ensure current sharing, parallel IGBTs are not allowed to have a large operating temperature difference, so it is required to ensure that the parallel IGBTs have the same heat dissipation conditions during heat...

AI Technical Summary

Problems solved by technology

Since the fan is installed at the air outlet of the air duct, the operating temperature is 7 to 10°C higher than that of the air inlet, and the increase in operating temperature will significantly reduce the operating life of the fan itself

[0007] (3) If an axial flow fan is used, at the same time, due to the large difference between the width of the fan outlet and the width of the air inlet of the heat sink, the air duct design is complicated and the wind loss is large

If the air duct design is unreasonable, it is easy to make the fan deviate from the normal working area, and the fan surge failure will occur, which will greatly reduce the life of the fan and the reliability of the system.

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