A method of manufacturing a molded inductor

A manufacturing method and molding technology, applied in the direction of inductors, inductors/transformers/magnets manufacturing, fixed inductors, etc., can solve the problems of coil insulation layer damage, large powder gap, low magnetic permeability, etc., to reduce power Loss, avoid short-circuit problem, effect of high magnetic permeability

Active Publication Date: 2018-07-03
SHENZHEN SUNLORD ELECTRONICS
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Problems solved by technology

[0004] The main purpose of the present invention is to propose a method for manufacturing molded inductors. By making the main magnetic powder into a slurry form and pressing it, it solves the problems of large powder gaps, low magnetic permeability and problems in the existing dry powder molding process. The technical problem that the insulation layer of the coil is damaged and the mold is damaged due to the need to use a large mold pressure due to the high conductivity

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  • A method of manufacturing a molded inductor
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Embodiment Construction

[0020] The present invention will be further described below in conjunction with specific embodiments and examples.

[0021] A specific embodiment of the present invention provides a method for manufacturing a molded inductor, including the following steps S1-S4:

[0022] S1. Making magnetic powder slurry: mixing magnetic powder, adhesive and solvent in a predetermined ratio to form magnetic powder slurry. In the magnetic powder slurry, the mass percentage of the magnetic powder is preferably more than 90%, and, in terms of mass parts, the ratio of the magnetic powder, the adhesive and the solvent is 100:3~5:4~8, that is, every 100 3-5 parts of adhesive and 4-8 parts of solvent can be added to 1 part of magnetic powder. More preferably, 3-4 parts of adhesive and 4-6 parts of solvent are added to every 100 parts of magnetic powder. In addition, in some embodiments, auxiliary preparations such as anti-settling agents, rheological additives and / or dispersants can also be added ...

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Abstract

The invention discloses a method for making a mold-pressed inductor. The method includes the following steps of S1, magnetic-powder slurry making, wherein magnetic powder, adhesives and solvents are mixed in the preset proportion, and magnetic-powder slurry is formed; S2, pressing, wherein the magnetic-powder slurry obtained in the step S1 is injected into a mold, the magnetic-powder slurry, a coil and a magnetic core are jointly pressed to allow at least a part of the solvents and at least a part of the adhesives in the magnetic-powder slurry to overflow out of the mold, the coil and the magnetic core are preplaced into the mold, and a mold-pressed blank in a preset shape is formed; S3, heating solidifying, wherein the mold-pressed blank obtained in the S2 is heated and solidified, and a molded blank is obtained; S4, terminal electrode making, wherein the molded blank obtained in the step S3 is subjected to appearance shaping so that an electrode can be led and exposed out of the molded blank, a terminal electrode is prepared, and the mold-pressed inductor is obtained.

Description

technical field [0001] The invention relates to a manufacturing method of a molded inductor. Background technique [0002] The functions of existing electronic products are becoming more and more powerful, which will inevitably lead to an increase in the current of electronic products in application, which puts forward higher current requirements for the power supply circuit of the product. , The production technology of power inductors is also constantly improving, from winding to molding, the upgrading of the molding process has been completed. [0003] The current integrated molding process is dry powder molding, which has certain limitations: 1) The granulated powder used for dry powder molding generally contains about 10% of adhesive, which makes the magnetic permeability of the molded product low. In order to improve the magnetic conductivity, which usually increases the molding pressure (up to 1200-1800MPa); 2) During molding, there are compressible gaps between the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00H01F41/04H01F17/04
CPCH01F17/04H01F41/00H01F41/046H01F2017/048
Inventor 伍检灿戴春雷王其艮
Owner SHENZHEN SUNLORD ELECTRONICS
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