Integrated circuit device, manufacturing method, circuit board, display panel and display device

Abstract

The invention discloses an integrated circuit device, a manufacturing method thereof, a circuit board, a display panel and a display device which are used for reducing space occupied by the integrated circuit device. When the integrated circuit device is arranged on a displayer, intelligent transparent display is easily achieved. The integrated circuit device comprises a substrate, a plurality of connection parts and an integrated circuit bare chip, the connection parts and the integrated circuit bare chip are arranged on the substrate, the integrated circuit bare chip comprises a plurality of connection points, and the connection parts are electrically connected with the connection points respectively in a one-to-one correspondence mode.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an integrated circuit device and a manufacturing method thereof, a circuit board, a display panel, and a display device. Background technique [0002] With the rapid development of display technology, more and more functions can be realized by the display. At present, various functions are realized mainly by setting silicon-based integrated circuit devices with different functions on the display, such as: setting on the display can realize automatic Silicon-based sensors for detection and automatic control functions. [0003] The manufacturing industry chain of silicon-based integrated circuit devices mainly includes fabs and packaging and testing factories. The following will introduce silicon-based sensors as an example. Silicon-based sensors refer to integrated circuit devices with sensing functions based on silicon-based processes. The wafer factory produces sensor chip bar...

AI Technical Summary

Problems solved by technology

[0005] To sum up, the silicon-based integrated circuit device in the prior art occupies a relatively large space, and most of the packaging materials in the prior art packaging are made of non-transparent materials. When the silicon-based integrated circuit device is placed on the display, it will not only occupy Larger space, and not conducive to the realization of intelligent transparent display

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